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Sn-4.0wt%Ag-0.5wt%Cu 솔더 접합계면의 강도특성과 미세파괴거동에 대한 In-situ관찰
이경근,최은근,추용호,김진수,이병수,안행근,Lee, Kyung-Keun,Choi, Eun-Geun,Chu, Yong-Ho,Kim, Jin-Soo,Lee, Byung-Soo,Ahn, Haeng-Keun 한국재료학회 2008 한국재료학회지 Vol.18 No.1
The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.