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마이크로 LED 전사, 접합, 그리고 불량 화소 수리 기술
최광성,엄용성,문석환,윤호경,주지호,최광문,Choi, K.S.,Eom, Y.S.,Moon, S.H.,Yun, H.G.,Joo, J.,Choi, G.M. 한국전자통신연구원 2022 전자통신동향분석 Vol.37 No.2
MicroLEDs have various advantages and application areas and are in the spotlight as next-generation displays. Nevertheless, the commercialization of microLEDs is slow because of high cost as well as difficulties in the transfer, bonding, and bad pixel repairing process. In this study, we review the development trends of transfer, bonding, and defective pixel repair technologies, which are critical for microLED commercialization, focusing on materials that determine these technologies. In addition, we focus on the simultaneous transfer bonding technology developed by the Electronics and Telecommunications Research Institute, which has been attracting enormous research attention recently.