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다구찌법을 이용한 IR 레이저 Flip-chip 접합공정 최적화 연구
송춘삼,지현식,김주한,김종형,안효석,Song, Chun-Sam,Ji, Hyun-Sik,Kim, Joo-Han,Kim, Jong-Hyeong,Ahn, Hyo-Sok 대한용접접합학회 2008 대한용접·접합학회지 Vol.26 No.3
A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.
송춘삼(Chun-Sam Song),지현식(Hyun-sik Ji),김주한(Joohan Kim),김종형(Jong-Hyeong Kim),김주현(Joo-Hyun Kim),장동영(Dong-Young Jang) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
A flip-chip bonding system using DPSS (diode pumped solid state) Nd:YAG laser (wavelength : 1064㎚) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat the solder balls diretly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.
송춘삼(Chun-Sam Song),지현식(Hyun-sik Ji),김주한(Joohan Kim),김종형(Jong-Hyeong Kim),김주현(Joo-Hyun Kim),장동영(Dong-Young Jang) 한국생산제조학회 2007 한국생산제조시스템학회 학술발표대회 논문집 Vol.2007 No.5
A flip-chip bonding system using DPSS (diode pumped solid state) Nd:YAG laser (wavelength : 1064㎚) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat the solder balls diretly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.
송춘삼(Chun-Sam Song),지현식(Hyun-sik Ji),김주한(Joohan Kim),김종형(Jong-Hyeong Kim),김주현(Joo-Hyun Kim) 한국생산제조학회 2008 한국생산제조학회지 Vol.17 No.1
A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.