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다구찌법을 이용한 IR 레이저 Flip-chip 접합공정 최적화 연구
송춘삼,지현식,김주한,김종형,안효석,Song, Chun-Sam,Ji, Hyun-Sik,Kim, Joo-Han,Kim, Jong-Hyeong,Ahn, Hyo-Sok 대한용접접합학회 2008 대한용접·접합학회지 Vol.26 No.3
A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.
송춘삼,김주현 한국공작기계학회 2005 한국생산제조학회지 Vol.14 No.1
The purposes of using cutting fluid during cutting have been cooling, lubricating, chip washing, and anti-corroding. However, the present manufacturing industry restricts the use of cutting fluid because cutting fluid contains poisonous substances which are harmful to the human body. Therefore dry cutting becomes an unavoidable assignment, and a lot of researches have studied cutting methods without using cutting fluid. Because dry turning is a continuous work, tools life is reduced by continuous heat generation and surface gets rough due to reduced lubrication, so it is important to consider these situations. In this paper, the way of selecting the optimal machining condition by the minimum number of experiments and the effectiveness of using compressed air in high hardness materials through Taguchi method have been found. Dry cutting using compressed air showed better cutting characteristics than normal dry cutting with respect to by cutting force, tool wear, and surface roughness. Also, the optimal machining condition for dry cutting using compressed air could be selected through Taguchi method.
다구찌 실험계획법을 이용한 드라이 선삭가공의 최적 가공조건 선정
송춘삼,김준현,김주현 한국공작기계학회 2003 한국공작기계학회 추계학술대회논문집 Vol.2003 No.-
Recently, various efforts to make more speedy and precision machine tool to improve productivity and also various efforts to solve environmental problem are going on, so that dry cutting in manufacturing industry, which needs environmental conscious design and development of manufacturing technique, is becoming a very important assignment to solve. Because dry cutting does not use cutting fluid, we need other methods that can be used instead of cutting fluid, which does cooling, lubricating, chip washing, and anti-corrosion. Especially, because turning is a continuous work, the consideration of tool life and surface roughness due to continuous heat and poor lubrication is important. The purposes of this paper are the consideration of how well the compressed air can work instead of cutting fluid, and also the development of the method to select the optimum machining condition by the minimum numbers of experiments through the Taguchi method.
송춘삼(Chun-Sam Song),조웅(Woong Cho),유재명(Jae-Myung Yoo),김주현(Joo-Hyun Kim),김종형(Jong-Hyeong Kim) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
TFT-LCD process has two advantages as compared with the semiconductor-process. It is that cycle time is short and number of the final products are small. But it is complex and high labor costs in the TFT-LCD process. Also, the process is a must for building PICS (Production Information and Control System) which automated and intelligent. In this paper, automated process of LCD module assembly line that can increases productivity and reduce the cost to strengthen the competitiveness corresponding with global market is planned in comparison with its manual/semi-auto. The result of the paper, the productivity will be increased about 1.5 times and cut down labor costs of 85%. In addition, whole assembly line can be short and simple.
X선 영상의 에지 추출을 통한 플립칩 솔더범프의 접합 형상 오차 검출
송춘삼(Chun-Sam Song),조성만(Sung Man Cho),김준현(Joon-Hyun Kim),김주현(Joo-Hyun Kim),김민영(Min young Kim),김종형(Jong-Hyeong Kim) 제어로봇시스템학회 2009 제어·로봇·시스템학회 논문지 Vol.15 No.9
The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.
송춘삼(Chun-Sam Song),지현식(Hyun-sik Ji),김주한(Joohan Kim),김종형(Jong-Hyeong Kim),김주현(Joo-Hyun Kim),장동영(Dong-Young Jang) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
A flip-chip bonding system using DPSS (diode pumped solid state) Nd:YAG laser (wavelength : 1064㎚) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat the solder balls diretly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.
IR 레이저를 이용한 COG 접합 공정 개발을 위한 실험적 연구
김주한,송춘삼,김종형,장동영 한국공작기계학회 2008 한국공작기계학회 춘계학술대회논문집 Vol.2008 No.-
A novel method for bonding COG chips on the substrate with IR laser irradiation is presented. The laser process for COG chip packaging has many advantages such as minimized heat affected zone, various bonding materials, selective bonding, and 3D packaging, In order to develop COG. chip bonding, an experimental study for a COG substrate with laser irradiation was performed. Various results could be obtained with respect to ablated or melted shapes of the metal lands, Successful melting of a land on COG substrate was realized on a range of 16.8 W/cm². Within this power density range, a constant result of bonding was shown. We can expect that this result can be applied for a COG bump-to-bump direct bonding process.