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전해도금법을 이용한 3 차원 미세 인덕터와 변압기의 제조
이종현,류인식,김이영,조백희,조찬섭 경북대학교 전자기술연구소 2001 電子技術硏究誌 Vol.22 No.2
This work was related to fabricated 3-dimensional device for need of micro-device in developing new intelligence age. This device was fabricated by electroplating used electroplating-PR and high-vacuum evaporation of metal. It consists of air-bridge on electroplating rod and electroplated core. Electroplating material is used Pb/Sn and Cu metal solvent. Air-gap between metal-layers function as almost perfect isolation layer. Thus, Leakage current is very low than other isolation layer as silicon-dioxide. The most advantage of 3-dimensional micro-inductor/micro-transformer compared to flat-inductor is a possibility that can fabricate high-permeability device with core and a ultra-high integration-rate than other 2-dimensional device.