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TFT-LCDs에 적용 가능한 Cu-Ag 박막에 대한 Mo 기판 위에서의 특성조사
이현민,이재갑,Lee, H.M.,Lee, J.G. 한국재료학회 2006 한국재료학회지 Vol.16 No.4
We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.
이현민(H. M. Lee),구자경(J. K. Ku),노학곤(H. G. Noh),송우진(W. J. Song),구태완(T. W. Ku),강범수(B. S. Kang),김정(J. Kim) 한국소성가공학회 2009 한국소성가공학회 학술대회 논문집 Vol.2009 No.10
Electromagnetic forming(EMF) is a high-velocity forming process which uses electromagnetic Lorentz force. Advantage of this forming technique are improved formability, reduction in wrinkling, non-contact forming and applications of various forming process. But the application of electromagnetic forming technique is still limited in industry. Thus for continuous research and development of technique based on experiments, develop the forming equipment and carry out the forming experiments for validation of forming equipment.