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Al-xSi-2Cu-1Mg/ySiC(x:6 , 12 , 18. y:0∼10wt.%) 계 복합재료의 열적성질에 관한 연구
박상준,조원용,강세선,임윤수,권혁무,윤의박 ( Sang Joon Park,Won Yong Jo,Se Seon Kang,Yoon Su Lim,Hyuk Mu Kwon,Eui Park Yoon ) 한국주조공학회 1993 한국주조공학회지 Vol.13 No.4
N/A The purpose of this study is to obtain basic information on the particle dispersion, the coefficient of thermal expansion and the thermal conductivity of compocasted Al-xSi-2Cu-1Mg/ySiC(x:6, 12, 18. y: 0∼10wt.%) composite. With increasing the content of SiC particles, the thermal expension coefficient and the thermal conductivity decrease. The coefficient of thermal expension between 20 and 300℃ is 21.3×10^(-6)/℃∼ 18.0×10^(-6)/℃ for the Al-Si alloys and 18.4×10^(-6)/℃∼16.0×10^(-6)/℃ for the composite with 10wt. % SiC. The thermal conductivity at 300℃ is 121∼169W·m^(-1)·k^(-1) for the Al-Si alloys and 114∼159W·m^(-1)·k^(-1) for the composite with 10wt. % SiC.