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강희신(H. S. Kang),서정(J. Suh),이제훈(J. H. Lee),김정오(J. O. Kim),신희원(H. W. Shin),김도열(D. Y. Kim) 한국정밀공학회 2006 한국정밀공학회 학술발표대회 논문집 Vol.2006 No.5월
This research is on a laser soldering using the micro solder-balls used in flip chip packaging process. A laser source used in laser soldering is Nd:YAG laser(250W and 60W). Solder-balls of 100, 300, 500㎛ size are used in experiments. The laser head to deliver a laser beam and the nozzle to transfer solder-balls are manufactured to bump solder-balls. After soldering solder-balls the shear test is carried out to determine the wetting at the interface between the surface and a solder-balls. With the results of solder bumping tests a laminated molding is accomplished for manufacturing the three dimensional molding.