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박홍래,이정민,성완,김원백,최종술 ( Hong Lae Park,Jeong Min Lee,Wan Sung,Won Beak Kim,Chong Sool Choi ) 한국열처리공학회 1995 熱處理工學會誌 Vol.8 No.4
The high strain-rate dynamic plastic behavior of Fe-X%Mn alloys was investigated. The strain rate did not have an effect when tested under quasi-static strain rates(2×10^(-3)/sec and 2×10^(-1)/sec). However, the true stress increased at all strain levels when the strain rate increased to 6×10³/sec. Based on the experimental results, an constitution equation to calculate the dynamic strength for strain rates over 10⁴/sec was determined. The Fe-5%Mn alloy containing athermal α` martensite initially did not show work hardening. The work hardening increased with Mn content showing a maximum at 20% Mn. The high work hardening of Fe-20%Mn and Fe-30%Mn alloys appears to be closely related not only to the initial amounts of E martensite but to the strain induced transformation (γ→ε and ε→α`) occurring during each stages of deformation.
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선형 CCD 센서를 적용한 ArF 파장대 웨이퍼 에지 노광장비의 제어에 관한 연구
박홍래(Hong-Lae Park),이철규(Cheol-Gyu Lee) 한국조명·전기설비학회 2008 조명·전기설비학회논문지 Vol.22 No.6
본 논문에서는 웨이퍼 에지 노광장비에 핵심 부분인 웨이퍼의 편심오차의 측정알고리즘과 플링/노치의 방향을 해석하는 알고리즘을 제안하였다. 또한 새로 제안된 알고리즘을 전산 시뮬레이션을 통해 그 유효성을 확인하였으며 제작된 웨이퍼 에지 노광기에 적용하여 실제 장비에 적용 가능함을 확인하였다. 제안된 알고리즘을 위해 필요한 웨이퍼 에지 위치 검출방식에 있어 과거의 접촉식 방법을 사용함으로서 발생하는 파티클의 오염을 제거하기 위해 선형 CCD 센서를 적용한 비접촉 방식의 데이터 측정법을 적용함으로서 파티클의 오염을 제어 할 수 있었다. This study presents a process control of the wafer edge exposure (WEE) used in 300[㎜] wafer environment WEE, as a key module of the overall track system (coater and developer) for making patterns on wafer, is a system to expose the UV-ray on the wafer to remove a photo resist around edge of the wafer. It can measure, memorize and control the distance and angles from wafer center to edge. Recently in the 300[㎜] semiconductor fabrication, the track system strongly requires that WEE station has a controller with high throughput and accuracy to increase process efficiency. We have designed and developed the controller, and present here a WEE control algorithm and experimental results.
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Fe-20%Mn 마르텐사이트 합금의 기계적 성질과 변태점에 미치는 열사이클의 영향
최종술,박홍래,류영항 대한금속재료학회(대한금속학회) 1995 대한금속·재료학회지 Vol.33 No.7
The effects of thermal cycling treatment on mechanical properties and transformation temperatures of Fe-20%Mn alloy were studied. With increasing number of the thermal cycling between room temperature and 260℃, the amount of ε martensite sharply increased up to 3 cycles and showed parabolic increase beyond 3 cycles, but the amount of γ austenite showed exactly the reverse. When the alloy was deformed to fracture at room temperature, the amount of ε martensite decreased but α′ martensite increased gradually with thermal cycling. On the other hand, γ could not be found except ε and α′ martensites in the fractured samples. As the number of thermal cycling increased, the hardness, UTS and YS of the alloy increased, the ε martensite plate became finer, a large number of dislocations were introduced in γ parent phase, and M_s was lowered.
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Fe-20%Mn 마르텐사이트 합금의 기계적 성질에 미치는 변형량 및 변형속도의 영향
김원백,최종술,박홍래,송영범 대한금속재료학회(대한금속학회) 1995 대한금속·재료학회지 Vol.33 No.9
The effects of compressive strain and strain rate on the strain-induced martensitic transformation and mechanical properties of Fe-20%Mn alloy were investigated. At low strain rates of 2×10^(-3)/sec and 2x10^(-1)/sec, the amounts of ε and α′ martensite increased with strain at the expense of γ. The increase was the largest at low strains up to 8%. At the highest strain rate of 6x10³/sec, the amount of retained γ increased due probably to the stabilization of γ by adiabatic heating during testing. The alloy showed high strain hardening especially in low strain range where most of the strain induced transformation occurred. The strain rate did not have an effect on strength when strain rates were low. When the strain rate increased to 6×10³/sec, the true stress increased at all strain levels. However, high strain rate did not increase the hardness. It seems that during a dynamic compression test an additional strengthening mechanism may work to increase the true stress. We believe that the dislocation drag effect may be responsible far the increase in stress during the high-rate compression test.
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