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Pleurotus ostreatus균 전처리에 의한 볏짚의 상압 바이오 소다펄프화
박헌도 ( Heon Do Park ),강진하 ( Jin Ha Kang ) 전북대학교 농업과학기술연구소 2010 농업생명과학연구 Vol.41 No.2
This study was performed to develop the biochemical pulping method to save the energy and decrease the capital cost in soda pulping. Rice straw was pretreated by Pleurotus ostreatus with either, glucose(G), nitrogen(N) and G+N for 5, 10, 15, 20, 25 and 30 days incubation respectively because of its selective delignification capacity. The total yield of untreated rice straw pulp was 53.5%. In the case of fungal pretreatment, the total yields of pulps showed the ranges of 48.3~28.4%. Consequently, according to the extending of incubation periods, the total yields of pulps were gradually decreased. The Kappa number of pulp made from untreated rice straw was 22.8. In the case of fungal pretreatment, the Kappa numbers were ranges of 26.6~17.4. In case of control and G, the Kappa number were increased until 15 days and in case of N and G+N, also were increased until 20 days. Thereafter, the Kappa number were decreased. In addition, the brightness of pulp made from untreated rice straw was 34.2. In the case of the fungal pretreatment, the brightness of rice straw pulps showed ranges of 28.2~34.9. The brightness were decreased until 15 days, thereafter were increased. The physical properties of soda pulp made from rice straw without fungal treatment, the density, breaking length, burst index, tear index and folding endurance were 0.48g/cm3, 4.82km, 3.37kPa · m2/g, 19.1mN · m2/g and 110 times, respectively. On the other hand, in case of fungal pretreatment, the physical properties of pulps made from rice straw were as follows. The density was 0.50~0.58g/cm3, the breaking length was 4.46~7.18km, burst index was 2.95~5.30kPa·m2/g, tear index was 8.5~18.9mN·m2/g and folding endurance was 8~328 times according to the conditions of nutrients and incubation periods. As a result, if the rice straw would be pretreated with fungi, it is possible to use the condition of atmospheric pressure in soda pulping of rice straw for low grade papers. Accordingly, we can reduce the capital cost and energy consumption in pulp mills where are using the non-wood plants such as rice straw as raw materials.
요소수지의 F/U 몰비별로 제조된 목질패널의 포름알데히드 장기 방출 경향
박헌,Park, Heon 한국가구학회 2000 한국가구학회지 Vol.11 No.2
This study was carried out to measure formaldehyde emission with the passing of two years from plywood, sliver-board and strand-board bonded with urea resins which were made of 6 f/U molar ratios. The urea resins were manufactured by six kinds of formaldehyde/urea molar ratio of 1.0, 1.2, 1.4, 1.6, 1.8 and 2.0. 1. The plywood with molar ratio of 1.0 satisfied the KS F3101 $F_2$ directly after manufacture. The plywood with molar ratio of 1.2 satisfied m 3 days. The plywood with molar ratio of 1.4 satisfied the $F_3$ in 3 days and the $F_2$ in 600 days. And the plywood with molar ratio of 1.8 and 2.0 satisfied the $F_3$ in 365 days, but didn't satisfy the $F_2$ in 730 days. 2. Sliver-board with molar ratio of 1.0 and 1.2 satisfied the KS F3104 $E_2$ right after manufacture. Sliver-board with molar ratio of 1.4 and 1.6 satisfied in 150 and 360 days, respectively. Sliver-board with molar ratio of 1.8 and 2.0 satisfied in 730 days. 3. Strand-board with molar ratio of 1.0 and 1.2 satisfied the KS F3104$ E_2$ directly after manufacture. Strand-board with molar ratio of 1.4 and 1.6 satisfied in 150 days. But Strand-board with molar ratio of 1.8 and 2.0 didn't satisfied in 730 days.
Power IC용 저면적 Differential Paired eFuse OTP 메모리 설계
박헌,이승훈,진교홍,하판봉,김영희,Park, Heon,Lee, Seung-Hoon,Jin, Kyo-Hong,Ha, Pan-Bong,Kim, Young-Hee 한국정보전자통신기술학회 2015 한국정보전자통신기술학회논문지 Vol.8 No.2
In this paper, a small-area 32-bit differential paired eFuse OTP memory for power ICs is designed. In case of smaller number of rows than that of columns for the OTP memory cell array, a scheme for the cell array reducing the number of SL driver circuits requiring their larger layout areas by routing the SL (source line) lines supplying programming currents for eFuse links in the row direction instead of the column direction as well as a core circuit is proposed. In addition, to solve a failure of being blown for non-blown eFuse links by the electro-migration phenomenon, a regulated voltage of V2V ($=2V{\pm}0.2V$) is used to a RWL (read word line) driver circuit and a BL (bit line) pull-up driver circuit. The layout size of the designed 32-bit eFuse OTP memory is $228.525{\mu}m{\times}105.435{\mu}m$, which is confirmed to be 20.7% smaller than that of the counterpart using the conventional cell array routing, namely $197.485{\mu}m{\times}153.715{\mu}m$. 본 논문에서는 Power IC용 저면적 32비트 differential paired eFuse OTP 메모리를 설계하였다. OTP 메모리 셀 어레이에서 행의 개수가 열의 개수보다 더 작은 경우 eFuse 링크의 프로그램 전류를 공급하는 SL (Source Line) 구동 라인을 열 방향으로 라우팅하는 대신 행 방향으로 라우팅하므로 레이아웃 면적을 많이 차지하는 SL 구동회로의 수를 줄이는 differential paired eFuse 셀 어레이 방식과 코어 회로를 제안하였다. 그리고 blowing되지 않은 eFuse 링크가 EM (Electro-Migration) 현상에 의해 blowing되는 불량을 해결하기 위해 RWL (Read Word-Line) 구동 회로와 BL (Bit-Line) 풀-업 부하회로에 V2V ($=2V{\pm}0.2V$)의 regulation된 전압을 사용하였다. 설계된 32비트 eFuse OTP 메모리의 레이아웃 면적은 $228.525{\mu}m{\times}105.435{\mu}m$으로 기존의 셀 어레이 라우팅을 이용한 IP 크기인 $197.485{\mu}m{\times}153.715{\mu}m$ 보다 20.7% 더 작은 것을 확인하였다.
요소-멜라민 공축합 수지의 요소와 멜라민 혼합비율이 합판의 포름알데히드 방출과 접착성에 미치는 영향
박헌,강은창,민경희,Park, Heon,Kang, Eun-Chang,Min, Kyeong-Heui 한국가구학회 2000 한국가구학회지 Vol.11 No.1
This study was to measure formaldehyde emission and bonding strength of plywoods manufactured with urea-melamine formaldehyde adhesives, which were made from three different mixing ratios of urea and melamine, and with four different formaldehyde/urea-melamine molar ratios of 1.0,1.1,1.2 and 1.4. The results were as follows 1. Amount of formaldehyde emission was the lowest at the first method of molar ratio(F/(M+U)) 1.0. Amounts of formaldehyde emission of experimental manufactured adhesives were lower than that of commercial adhesive. 2. Bonding strength of dry specimen was the highest at the first method of molar ratio(F/(M+U)) 1.4. Dry bonding strength of molar ratio(F/(M+U)) 1.4 was similar to commercial adhesive. 3. Bonding strength of wet specimen was the highest at the second method of molar ratio(F/(M+U)) 1.4. Bonding strength of wet specimen used by the third method of molar ratio(F/(M+U)) 1.4 was almost equal to commercial adhesive.
다중 프로세서 버스 시스템에서의 분산형 비동기 임의 큐잉 프로토콜의 구현
김성천(Sung-Chun Kim),박헌일(Heon-Il Park) 한국정보과학회 1995 정보과학회논문지 Vol.22 No.5
다중 프로세서 시스템(multiprocessor system)에서 사용되고 있는 상호 연결망(interconnection network)중 버스 시스템(bus system)은 다른 상호 연결망보다 구현과 확장의 용의성으로 가장 널리 쓰이는 상호 연결망 구조이다. 버스 시스템에서는 공정하고 빠른 메모리 액세스(memory access)를 위한 중재 프로토콜(arbitration protocol)이 버스 시스템의 성능에 큰 영향을 미친다. 그러므로 주어진 버스 시스템 환경에 가장 큰 영향을 미치는 요인(공정성과 중재 시간)에 따라 버스 시스템 중재 프로토콜을 사용해야 한다. 본 논문에서 제안하는 중재 프로토콜인 분산형 비동기 임의 큐잉 프로토콜은 우선 순위를 임의적으로 부과로 공정성을 최대한 보장하도록 하였으며 이 프로토콜의 빠른 중재를 위해서 경쟁 논리 회로를 사용하였다. 또한 시스템 큐를 사용하여 데이타 전송 버스의 사용과 중재를 분리하고, 상호 비동기적으로 수행되는 큐잉 프로토콜 구현으로 프로세서의 재시도(retry)에 의한 프로세서의 부하(load)를 줄여 버스 사용 요청에서 버스 점유까지 지연 시간(waiting time)을 최소화하였다. Among many interconnection networks in multiprocessor systems, the bus system is widespreadly used because of its easy implementation and expansion. For fair and fast memory access, the arbitration protocol has a great impact on a bus system performance. Since fair and fast memory access affect each other, two factors should be adjusted appropriatly using the most suitable bus system arbitration protocol in the environment. The proposed distributed asynchronous random-queueing arbitration protocol in this paper guarantees fairness maximally by imposing priorities to bus requests at random. For fast arbitration, this protocol adopts the competition logic circuit. Since data transfer and arbitration are separated by using a system queue and processor load due to retry is reduced by implementing mutual asynchronous queueing protocol waiting time from bus request to bus hold is minimized. The performance analysis shows that the average memory access time of the proposed protocol is proportional to the average system queue size and also shows that the retry rate due to bus traffic increament is lower than the ones in other protocols. Therefore this protocol has excellent performance especially in the multiprocessor system which has large number of processor modules and heavy traffic.