http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
박일송(Il-Song Park) 육군사관학교 화랑대연구소 2017 한국군사학논집 Vol.73 No.3
The Second Lebanon War in 2006 lasting a short period of 34 days presents some tremendous impacts on history of war. This Israel-Hezbollah conflict started with a raid and kidnapping of Israeli soldier by the Hezbollah units and expanded to a war with the Israel’s retaliation. The way of war conducted by both sides was somewhat different between two unbalanced actors - one a state with top-ranked military power in the region, the other a group of militants with small guerilla forces, and in the end Israel did not achieve its war aim while Hezbollah earned what it intented - survival. After the war ended, two questions have caught researchers and military professionals who seek lessons. One is what happened, and the other is what impact this war left on history. This paper focuses on the second subject and draws three conclusions. First, it has bees apparent that the effect-based operations(EBO) alone not bring a win or success. Aa a result, US military declared in 2008 it would not rely on EBO doctrine anymore. Second, it became a leap-board to the ground forces which had been neglected since the Gulf War. Many states began to reconsider the mission and role of the ground forces. Lastly, The 2006 Lebanon War inspires the debates on the ‘new’ way of warfare and brings a ’new’ discourse of the hybrid war to the history of war.
니오븀함량에 따른 치과용 Ti - xNb 합금의 물리적 성질
박일송(Il-Song Park),박정은(Jung-Eun Park),지정희(Jeong-Hui Ji),Jin Guang-Chun,윤동주(Dong-Joo Yoon),박주미(Ju-Mi Park) 대한치과재료학회 2011 대한치과재료학회지 Vol.38 No.1
The materials currently used for surgical implants include 316L stainless steel (316LSS), cobalt chromium (Co-Cr) alloys and titanium and its alloys. Elements such as Ni, Cr and Co are found to be released from the stainless steel and cobalt chromium alloys due to the corrosion in the body environment. The materials currently used for surgical implants include 316L stainless steel (316LSS), cobalt chromium (Co-Cr) alloys and titanium and its alloys. Elements such as Ni, Cr and Co are found to be released from the stainless steel and cobalt chromium alloys due to the corrosion in the body environment. The relative intensity o f β phase increased according to t he increase of niobium contents. Also the dendrite structures were changed to globular structures with increasing niobium contents. The microhardness values and corrosion resistance of all the Ti-xNb alloys were significantly higher than that of pure Ti and the Ti-37Nb alloy showed the best corrosion resistance among the other groups.
구리 전해도금 시 표면형상과 기계적 특성에 미치는 HEC효과
우태규,박일송,이현우,설경원,Woo, Tae-Gyu,Park, Il-Song,Lee, Hyun-Woo,Seol, Kyeong-Won 한국재료학회 2006 한국재료학회지 Vol.16 No.11
The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).
정펄스 및 역펄스 방법을 이용하여 구리 전해도금 시 전착층의 표면 형상과 고유저항에 미치는 효과
우태균,박일송,설경원,Woo, Tae-Gyu,Park, Il-Song,Seol, Kyeong-Won 한국재료학회 2007 한국재료학회지 Vol.17 No.1
Recently, requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. In this study, we evaluated the surface morphology, crystal phase ana surface roughness of the copper film electrodeposited by pulse method without using additives. Homogeneous and dense copper crystals were formed on the titanium substrate, and the optimum condition was 25% duty cycle. Moreover, the surface roughness(Ra), $0.295{\mu}m$, is the smallest value in this condition. It is thought that this copper foil is good for electromigration inhibition due to the preferential crystal growth of Cu (111)
Seed 금속의 종류와 두께에 따른 구리 전착층의 표면형상에 미치는 영향
우태규,박일송,설경원,Woo, Tae-Gyu,Park, Il-Song,Seol, Kyeong-Won 한국재료학회 2007 한국재료학회지 Vol.17 No.5
This study aimed to investigate the effects of the seed layer with copper electroplating on the surface morphology of copper foil. Three kinds of seed metal such as platinum, palladium, Pt-Pd alloy were used in this study. Electrodeposition was carried out with the constant current density of 200 $mA/cm^2$ for 68 seconds. Electrochemical experiments, in conjunction with SEM, XRD, AFM and four-point probe, were performed to characterize the morphology and mechanical characteristics of copper foil. Large particles were observed on the surface of the copper deposition layer when a copper foil was electroplated on the 130 nm thickness of Pd, Pt-Pd seed layer. However, a homogeneous surface, low resistivity was obtained when the 260 nm thickness of Pt, Pt-Pd alloy seed layer was used. The minimum value of resistivity was 2.216 ${\mu}{\Omega}-cm$ at the 260 nm thickness of Pt-Pd seed layer.
우태규,박일송,정광희,설경원,Woo, Tae-Gyu,Park, Il-Song,Jung, Kwang-Hee,Seol, Kyeong-Won 한국재료학회 2010 한국재료학회지 Vol.20 No.10
This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.
티타늄 기지을 이용한 구리 전해도금 시 Arabic Gum 첨가제의 영향
우태규,박일송,이현우,설경원,Woo, Tae-Gyu,Park, Il-Song,Lee, Hyun-Woo,Seol, Kyeong-Won 한국재료학회 2006 한국재료학회지 Vol.16 No.12
The purpose of this study is to identify the effect of additives during copper electrodeposition. Additives such as arabic gum, chloride ions and glue were used in this study. Electrochemical experiments allied to SEM and roughness examination were performed to characterize of the copper foil in the presence of additives. In the production of electrodeposited copper foil, the surface roughness and grain size of the copper foil can be controlled by addition additives. on this study, the more uniform and hemispherical copper crystals are during the initial stages, the smaller crystal size and surface roughness of copper foil are. The surface roughness of copper foil electrodeposited at the current density of 500 $mA/cm^2$ under galvanostatic mode for 60 seconds has a minimum value of 0.136 ${\mu}$m when adding 2 ppm of arabic gum.