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Al-Insert 사출성형을 이용한 자동차 내장재 부품 개발에 관한 연구
노태정(T.J. Lho),김진영(J.Y. Kim),강동중(D.J. Kang),김종학(J.H.Kim),김기일(G.Y.Kim) 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
Generally, Aluminum is superior to durability, light, and characteristics of the material are embossed luminant. So, these characteristics of aluminum will be used automobile interior parts by aluminum injection moulding. Especially, The external of Aluminum plate is engraved differing pattern by roller working. This working can use any longer and be seen gracefully. This is the reason why aluminum insert moulding is used. This feature of research can be characterized by simple process to customize aluminum sheet of blanking and forming process with internal parts of configuration if products are injected by aluminum sheet. Besides, to analysis completed Automobile interior parts to be concerned volumetric shrinkage, best gate location, fill time analysis and so on through the mold-flow before the aluminum insert moulding is worked.
Copolyamide 블렌드의 PE 함량에 따른 용융거동 및 접착특성
김정일,오인석,주혁종,김종학 忠南大學校 産業技術硏究所 1998 산업기술연구논문집 Vol.13 No.2
In this study melting behaviors and adhesive properties of copolyamide/PE-g-MAH and copolyamide/HDRE blends were examined by changing the PE content. In copolyamide/PE-g-MAH blend, the addition of PE-g-MAH lowered overall melting temperature. In copolymaide/HDPE blend,as the amount of HDPE increased, the lst melting temperature of copolyamide was increased, while the 2nd melting temperature was decreased. Analysis with SEM and polarization microscope revealed no phase separation in copolyamide/PE-g-MAH blend. However, in copolyamide/HDPE blend apparent phase separation appeared and the size of dispersed phase was increased with the content of HDPE. In copolyamide/PE-g-MAH blend, PE-g-MAH resulted in slightly improved adhesive strength for aluminium when 2phr was added, but the tendency reached a plateau when more than 2phr was added. In copolyamide/HDPE blend, the adhesive strength was increased up to 2phr addition of PE-g-MAH, then reached a plateau.
황영규,김종학 기계기술연구소 1999 성균관대학교 논문집 기계기술편 Vol.1 No.1
To improve cooling performance of the heat sinks for PC monitor by adequate natural convective heat transfer, some experimental investigations have been performed. Heat generation rates of electronic components and temperature distributions of heat sinks with surrounding air were accurately measured for the heat transfer simulation. Also, new correlations of Nu. with Ra. for heat sink models are presented.