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김원태,이윤표,윤성영,Kim, W.T.,Lee, Y.P.,Yoon, S.Y. 대한설비공학회 1997 설비공학 논문집 Vol.9 No.4
In the present study, the cooling package using the heat pipe has been developed to improve the thermal performance in the point of cooling characteristics of the electronic chip placed to the subrack being readily assembled and disassembled in ATM switching system. As the preliminary experiments, the cooling performances between a conventional way using a cooling fin and a proposed method applying the heat pipe are compared and analyzed. The cooling performance at a simulated electronic component packaging a heat pipe module is approximately achieved up to $5.0W/cm^2$ heat flux and the allowable temperature at the heated chip is sustained in the range within $70^{\circ}C$. From the results, it is confirmed that temperature oscillations are also settled by inserted wick in the evaporator section. From the user's viewpoint, the method to assemble and disassemble the heat pipe easily has been devised.
김원태(W. T. Kim),옥성민(S. M. Oak),문영훈(Y. H. Moon) 대한기계학회 2002 대한기계학회 춘추학술대회 Vol.2002 No.4
The effects of the stirring velocity, fluid viscosity, stirring height and stirrer's size on molten aluminum foam generation process are intensively analysed by the physical modeling with specially designed equipment. The number, distribution and size of bubbles varied with process parameters but the most important parameters are stirring velocity and fluid viscosity. The results obtained from physical modeling have been confirmed by actual aluminum foam genetration experiments at the similarity of process factors.