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RISS 인기검색어
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- 저자 : 김옥래(Ok Rae Kim) (검색결과 9 건)
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김옥래(Ok Rae Kim),우창기(Chang Ki Woo) 한국생산제조학회 2011 한국생산제조학회지 Vol.20 No.4
In this paper, using by rapid heating and cooling systems for injection molding and temperatures to changes. In the process of molding temperature and pressure inside the mold was found. In addition, the tensile strength of test specimens were molded, mechanical properties of injection molded parts were identified on mold temperature. Copper could withstand more tensile force than NAK. Therefore, it can be concluded that materials with high heat conductivity must be used in thin walled products.
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페트용기 성형을 위한 프리폼 사출성형 및 블로우 성형의 실험 및 해석에 관한 연구
김정순(Kim, Jeong-Soon),김종덕(Kim, Jong-Deok),김옥래(Kim, Ok-Rae),권창오(Kwon, Chang-Oh) 한국산학기술학회 2008 한국산학기술학회논문지 Vol.9 No.5
본 연구는 성형해석 및 실험적 방법을 통하여 페트 용기의 두께 편차를 최소화하기 위한 프리폼 최적화 설계를 수행하였다. 사출성형과정을 정확하게 묘사하기 위하여 3차원 모델을 이용하여 충진, 보압 및 냉각해석을 통하여 최적의 프리폼 설계변수를 설정하였으며, 이 결과를 이용하여 블로우 성형해석을 수행하였다. 성형해석결과를 평가하기 위한 사출성형 및 블로우 성형 실험을 수행하였으며, 실험결과와 해석결과는 정성적으로 일치하는 것을 확인 하였다. 이러한 실험결과 데이타를 설계에 반영함으로서 최적의 프리폼 형상을 얻을 수가 있었다. This study presents the preform injection molding and the blow molding of the injection stretch-blow molding process for PET bottles. The numerical analysis of the injection molding and the blow molding of a preform is considered in this paper using CAE with a view to minimize the warpage and the thickness. In order to determine the design parameters and processing conditions in injection/blow molding, it is very important to establish the numerical model with physical phenomenon. In this study, a three dimensional model has been introduced for the purpose and flow simulations of filling, post-filling and cooling process are carried out. The simulations resulted in the warpage in good agreement with the measurements. Also, from the result of numerical analysis, we appropriately predicted the warpage, deformation and thickness distribution along the product walls.
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블로우 성형공정변수가 PET 용기에 미치는 영향에 관한 연구
김종덕,고영배,김옥래,박형필,김홍렬,권창오,Kim, Jong-Dug,Go, Young-Bae,Kim, Ok-Rae,Park, Hyung-Pil,Kim, Hong-Ryul,Kwon, Chang-Oh 한국금형공학회 2008 한국금형공학회지 Vol.2 No.6
Injection-stretch blowing system for preform has been developed in this study. The preforms for injection blow molding and injection stretch blow molding are being manufactured by injection molding. However it contains gate mark that affects the bottom crack in the PET bottle. The compression molded preform does not contain gate mark, thus the appearance quality of bottle has been increased and the residual stress near gate(bottom of the bottle) has been reduced. The thickness distributions, haze, and transmittance are well accepted for the preform. Also, flow characteristics of the resin between a core and cavity could be analyzed through computer simulation.
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자동차핸들 제품의 CAE해석을 활용한 가스 사출성형에 관한연구
강세호(Kang, Sae-Ho),우창기(Woo, Chang-Ki),김옥래(Kim, Ok-Rae) 한국산학기술학회 2015 한국산학기술학회논문지 Vol.16 No.11
플라스틱 사출성형제품은 금형을 제작하여 대량생산에 적합한 시스템으로서 두께가 두꺼운 자동차 핸들제품은 가스 사출성형을 수행하는 것이 바람직하다. 가스사출성형은 용융된 원재료를 금형내로 충전시킨 후 질소가스를 주입하는 기술이 다. 가스사출성형은 재료비절감, 품질향상 등 많은 장점을 가지고 있다. Moldflow소프트웨어를 활용하여 사출성형 공정을 해석하여 제품의 휨 변형을 최소하기 위한 게이트의 위치를 결정하였으며, 기존의 일반적인 PP재료로 가스사출 성형을 했을 경우 변형이 크게 발생되므로 미네랄이18% 함유된 PP 재료로 변경하여 사출제품의 휨 변형을 최소로 하는 것과 게이트의 위치를 변경하여 핑거링현상이 발생하는 트러블을 제거하는 것을 목적으로 하였다, 또한 가스 사출성형을 수행하였을 경우 원재료가 유입되고 난후 게이트를 기준으로 가스가 유입된 형상을 파악하기 위해 비교분석해 보았다. 본 연구를 통해 제품형 상에 따른 두께의 변화와 가스사출성형을 수행하더라도 플라스틱의 재료에 따라 제품의 휨이 발생 될 수 있다는 것과 게이트 의 위치가 제품의 트러블에 영향을 미친다는 것을 알 수 있었다. As plastic injection mold parts is suitable system mass production making mold. So thick steering wheel parts is desirable to carry out gas injection molding. Gas injection mold is skill to inject nitrogen gas postfilling melting raw material into mold. Gas injection mold have many advantage like retrenchment of material cost, upgrading the guality. etc. It was decided gate position to minimize warpage of parts analysis injection mold process using mold flow software and incase doing gas injection mold using normal p.p material. it occur big warpage. so it is object minimizing warpage of injection parts to change p.p material containing mineral 18% and removing fingering phenomenon trouble as changing gate position. Also in case carrying out gas injection mold, I did comparison and analysis to grasp shape flow in gas setting a standard gate after flowing in raw material. Through this study, I found out changing of thickness by parts shape and it can occur warpage of parts by plastic material even though it carry out gas injection mold and it had a direct influence on trouble of parts by gate position.
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공정시간 및 온도에 따른 웨이퍼레벨 패키지 접합 최적설계에 관한 연구
고현준(Hyun-Jun Ko),임승용(Seung-Yong Lim),김희태(Hee-Tea Kim),김종형(Jong-Hyeong Kim),김옥래(Ok-Rae Kim) 한국생산제조학회 2014 한국생산제조학회지 Vol.23 No.3
Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.
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고현준(Hyun-Jun Ko),이상철(Sang-Chul Lee),김옥래(Ok-Rae Kim),김성규(Sung-Gyu Kim),윤언경(Eon-Gyeong Yun) 한국생산제조학회 2011 한국생산제조시스템학회 학술발표대회 논문집 Vol.2011 No.4
Machine tool industry to influence the competitiveness of the manufacturing core of capital goods, industrial precision equipment industry, as Germany and Japan as well as developed countries to recognize the key industries of the country through cutting edge technology and striving for national competitiveness is the main area. In order to process the inside of those artifacts, such as a laser or grinding tool with a processing device to processing inside to the workpiece. In this paper, solving the problem of processing devices and users inside the processing device can be machined into the desired shape is intended to design.
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고현준(Hyun-Jun Ko),박균명(Gyun-Myoung Park),김옥래(Ok-Rae Kim),송춘삼(Chun-Sam Song),김준현(Joon-Hyun Kim),김종형(Jong-Hyeong Kim) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.4
This paper aimed at the air-pad design of non-contact transfer for wafer. It is focused on precise control for minimization of pneumatic loss, prevention of wafer secession, and reduction of wafer shock during holding the wafer. Analysis are performed at design parameters of path length for hand device injection port, inlet air size, and central out let hole of air pad. The results are analyzed with effective air flow field including lifting force. It is seen that this system adopting the Bernoulli principle can be applied to non-contact transfer line through the capacity results of air pad design and negative pressure distribution by swirl creating flow field.
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