http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
다중 오리피스 노즐을 이용한 충돌분류의 열전달 향상에 관한 실험적 연구
김예용,정기호,김귀순,서태범 대한설비공학회 1999 설비공학 논문집 Vol.11 No.5
An experimental study has been peformed to investigate the heat transfer characteristics of impinging jets with multiple orifice nozzles. Four different shapes of multiple orifice nozzle were tested to improve the heat transfer characteristics of impinging jet. Heat transfer coefficients were obtained by using transient and steady method based on the liquid crystal thermography, and both methods showed very similar results. The effects of multiple orifice nozzles on the heat transfer characteristics of impinging jets were discussed in detail. The results showed that multiple orifice nozzles improved the heat transfer characteristics of impinging jet. Especially, heat transfer coefficients around stagnation region of impinging jets were highly increased.
김예용,김귀순,Kim, Ye Yong,Kim, Kui Soon 대한기계학회 1999 大韓機械學會論文集B Vol.23 No.3
An experimental study has been performed to investigate the heat transfer characteristics of impinging jets with corrugated nozzle and wake generation plate. Three different shapes of corrugated nozzle and five different shapes of wake generation plate were tested to improve the heat transfer characteristics of impinging jet. Heat transfer coefficients were obtained by using transient method based on the liquid crystal thermography. The effects of corrugated nozzle and wake generation plate on the heat transfer characteristics of impinging jets were discussed in detail. The results showed that both the corrugated nozzle and the wake generation plate improved the heat transfer characteristics of impinging jet. Especially, heat transfer coefficients around stagnation region of impinging jets were highly increased.
Notebook Palm Rest 온도 저감에 관한 수치 & 실험적 연구
김예용(Ye Yong Kim),고기탁(Ki Tak Ko),이혁기(Hyuk Ki Lee),이성호(Sung Ho Lee) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5
Nevertheless CPU TDP(Thermal Design Power) increases dramatically every year, customers require lighter, thinner, and cooler notebook. Because platform TDP increases by over 25% every year, thermal view point is focused on platform cooling as well as CPU cooling. Because of this TDP pattern, new phenomena which were neglected in the past start to appear. Among these phenomena, this paper focus on the notebook palm rest. Because palm rest is where people hand, exactly palm, is laid, this part is considered as very important to customer in terms of sensitivity. In this paper, some technologies are introduced from past technology including aluminum or copper plate and heat pipe to new technology including plate heat pipe.