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계층적 멀티스케일 하이브리드 나노물질을 이용한 투명 유연 전극소자 공정
김권규(Kyun Kyu Kim),고승환(Seung Hwan Ko),이필립(Phillip Lee),함주연(Jooyeun Ham),이진환(Jinhwan Lee) 대한기계학회 2014 대한기계학회 춘추학술대회 Vol.2014 No.11
Future electronics are expected to ultimately be in the form of wearable electronics. To realize wearable electronics, the electric components should be soft, flexible, and even stretchable to be human-friendly. Here we present a novel method of hierarchical multiscale hybrid nanocomposites of Carbon nanotube and Silver nanowire for highly, stretchable, or transparent conductors. The hybird nanocomposites presents enhanced electrical conductivity and optical transparency of relatively bigger Ag nanowire backbone providing efficient multiscale electron transport path with the local CNT percolation network. The highly elastic hybrid nanocomposite conductors and highly transparent flexible conductors can be mounted on any non-planar or soft surfaces to realize human-friendly electronics interface for future wearable electronics.
Kyun Kyu Kim(김권규),Jinhyeong Kwon(권진형),Hyun Min Cho(조현민),Seung Hwan Ko(고승환) 대한기계학회 2016 대한기계학회 춘추학술대회 Vol.2016 No.12
Copper nanomaterials suffer from severe oxidation problem despite the huge cost effectiveness. The effect of two different processes for conventional tube furnace heating and selective laser sintering on copper nanoparticle paste is compared in the aspects of chemical, electrical and surface morphology. The thermal behavior of the copper thin films by furnace and laser is compared by SEM, XRD, FT-IR and XPS analysis. The selective laser sintering process ensures low annealing temperature, fast processing speed with remarkable oxidation suppression even in air environment while conventional tube furnace heating experiences moderate oxidation even in Ar environment. Moreover, the laser-sintered copper nanoparticle thin film shows good electrical property and reduced oxidation than conventional thermal heating process. Consequently, the proposed selective laser sintering process can be compatible with plastic substrate for copper based flexible electronics applications.