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AI-Driven BGA Solder Joint Failure Detection of PCB Assembly
Seunghun Baek(백승훈),Jaeyoon Sim(심재윤),Siyeon Park(박시연),Cheolung Yang(양철웅),Songyi Jeon(전송이),Jongho Song(송종호),Won Hwa Kim(김원화) 대한전자공학회 2023 대한전자공학회 학술대회 Vol.2023 No.11
This paper introduces an AI-driven approach to bolster the reliability of automatic solder joint failure detection for PCB Assembly development. Our method employs a 2-stage framework integrating localization and classification. To address domain specific challenges, we propose a post-training correction method based on a fixed solder joint arrangement. Our work is validated on unseen data acquired in a field.