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김동익,김덕경,허세호,이병붕,김용신,김은숙,문지영,도영수,신성욱,김동수,김만태,진재욱,김용신 대한혈관외과학회 2002 Vascular Specialist International Vol.18 No.1
As medical technology progresses rapidly, there is a rise in the average age along with the Korean dietary lifestyle becoming more westernized, which leads to an increase in the number of vascular disease patients in Korea. Thus, we need to manage the medical information of a disease systematically in order to diagnose and treat constructively. However, since there has been no standardized method of man agement to date, a great deal of information could not be properly utilized nor studied. Therefore, the departments of Cardiology, Radiology and Neurology of Samsung Seoul Hospital recently got together to develop an information management system called the Vascular Data System. This program was developed to be run on win98 O/S, upper Pentium Ⅲ, and upper 128 MB Memory, and its source code is Dephi 4.0. It was configured for the user to set the configurations as well as do a variety of search and analysis. If this program were to be updated continuously, it may be used extensively as well as in various parts of clinical research activities.
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Copper Seed Layer 형성 및 도금 첨가제에 따른 Copper Via Filling
이현주,지창욱,우성민,최만호,황윤회,이재호,김양도,Lee, Hyun-Ju,Ji, Chang-Wook,Woo, Sung-Min,Choi, Man-Ho,Hwang, Yoon-Hwae,Lee, Jae-Ho,Kim, Yang-Do 한국재료학회 2012 한국재료학회지 Vol.22 No.7
Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.
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이종원,이미경,이형옥,이성계,도재호,김만욱 ( Jong Won Lee,Mi Kyung Lee,Hyung Ok Lee,Seong Kye Lee,Jae Ho Do Man Wook Kim ) 한국응용생명화학회 1997 Applied Biological Chemistry (Appl Biol Chem) Vol.40 No.5
The purpose of this study was to investigate the differences in proximate composition, free sugars, amino acids, fatty acids and Hunter color values between fresh and odorless garlic. The contents of crude fiber, crude fat and ash in odorless garlic were similar to those in fresh garlic. Sugars and crude protein decreased during manufacture of odorless garlic. Among the free sugars, sucrose, maltose and fructose decreased in odorless garlic, while the content of glucose increased. Total amino acid content decreased by about 30% in odorless garlic. Among the amino acids decreased arginine, isoleucine etc. The contents of linoleic acid, palmitic acid and oleic acid were higher than those of other fatty acids in fresh garlic and odorless garlic, but laruric acid was in little quantity. There were no significant differences in the Hunter L and b value between the fresh and odorless garlic, but value for greeness(-a) was lower in odorless garlic.
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