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RISS 인기검색어
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- 저자 : Cheng-En Ho (검색결과 2 건)
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Cheng-En Ho,Wan-Zhen Hsieh,Tsung-Hsun Yang 대한금속·재료학회 2015 ELECTRONIC MATERIALS LETTERS Vol.11 No.1
The early stage of soldering reaction between Sn-3Ag-0.5Cu solderand ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu pad was investigatedby field-emission scanning electron microscopy (FE-SEM) inconjunction with field-emission electron probe microanalysis (FEEPMA)and high-resolution transmission electron microscopy(HRTEM). FE-SEM, FE-EPMA, and HRTEM investigationsshowed that Ni2SnP and Ni3P were the predominant P-containingintermetallic compounds (IMCs) in the soldering reaction and thattheir growth behaviors strongly depended on the depletion of Ni(P). The growth of Ni3P dominated over that of Ni2SnP in the earlystage of soldering, whereas the Ni3P gradually transformed intoNi2SnP after Ni(P) depletion. This Ni(P)-depletion-induced Ni2SnPgrowth behavior is different from the reaction mechanisms reported in the literature. Detailed analyses of the microstructuralevolution of the IMC during Ni(P) depletion were conducted, and a two-stage reaction mechanism was proposed to rationalizethe unique IMC growth behavior.
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Inhibiting the Growth of Cu3Sn and Kirkendall Voids in the Cu/Sn-Ag-Cu System by Minor Pd Alloying
Cheng En Ho,,Tsai Tung Kuo,Chun Chien Wang,Wei Hsiang Wu 대한금속·재료학회 2012 ELECTRONIC MATERIALS LETTERS Vol.8 No.5
In this study, the metallurgical reaction between Cu substrates (electrolytic type) and a Sn3Ag0.5Cu-xPd alloy at 180°C was examined using a scanning electron microscope (SEM), electron probe microanalyzer (EPMA),focused ion beam (FIB) microscope, and transmission electron microscope (TEM). The results showed that the growth of Cu3Sn in the Cu/Sn-Ag-Cu solder joints was substantially suppressed by doping with a minor quantity of Pd (0.1-0.7 wt. %) in the solder alloy. The sluggish growth of Cu3Sn reduced the formation of Kirkendall voids at the Cu/Cu3Sn interface and significantly improved the mechanical reliability of the joint interface. It was argued that a minor addition of Pd into the solder stabilized the Cu6Sn5 phase and enlarged the interdiffusion coefficient of Cu6Sn5 but diminished that of the neighboring phase (Cu3Sn), thereby decreasing the Kirkendall effect in the Cu/Sn-Ag-Cu reactive system.
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