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Cheng-En Ho,Wan-Zhen Hsieh,Tsung-Hsun Yang 대한금속·재료학회 2015 ELECTRONIC MATERIALS LETTERS Vol.11 No.1
The early stage of soldering reaction between Sn-3Ag-0.5Cu solderand ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu pad was investigatedby field-emission scanning electron microscopy (FE-SEM) inconjunction with field-emission electron probe microanalysis (FEEPMA)and high-resolution transmission electron microscopy(HRTEM). FE-SEM, FE-EPMA, and HRTEM investigationsshowed that Ni2SnP and Ni3P were the predominant P-containingintermetallic compounds (IMCs) in the soldering reaction and thattheir growth behaviors strongly depended on the depletion of Ni(P). The growth of Ni3P dominated over that of Ni2SnP in the earlystage of soldering, whereas the Ni3P gradually transformed intoNi2SnP after Ni(P) depletion. This Ni(P)-depletion-induced Ni2SnPgrowth behavior is different from the reaction mechanisms reported in the literature. Detailed analyses of the microstructuralevolution of the IMC during Ni(P) depletion were conducted, and a two-stage reaction mechanism was proposed to rationalizethe unique IMC growth behavior.