http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Belle II silicon vertex detector
Belle II-SVD Collaboration,Adamczyk, K.,Aihara, H.,Angelini, C.,Aziz, T.,Babu, V.,Bacher, S.,Bahinipati, S.,Barberio, E.,Baroncelli, Ti.,Baroncelli, To.,Basith, A.K.,Batignani, G.,Bauer, A.,Behera, P. North-Holland 2016 Nuclear Instruments & Methods in Physics Research. Vol.831 No.-
The Belle II experiment at the SuperKEKB collider in Japan is designed to indirectly probe new physics using approximately 50 times the data recorded by its predecessor. An accurate determination of the decay-point position of subatomic particles such as beauty and charm hadrons as well as a precise measurement of low-momentum charged particles will play a key role in this pursuit. These will be accomplished by an inner tracking device comprising two layers of pixelated silicon detector and four layers of silicon vertex detector based on double-sided microstrip sensors. We describe herein the design, prototyping and construction efforts of the Belle-II silicon vertex detector.
A bonding study toward the quality assurance of Belle-II silicon vertex detector modules
Belle-II SVD Collaboration,Kang, K.H.,Jeon, H.B.,Park, H.,Uozumi, S.,Adamczyk, K.,Aihara, H.,Angelini, C.,Aziz, T.,Babu, V.,Bacher, S.,Bahinipati, S.,Barberio, E.,Baroncelli, T.,Basith, A.K.,Batignani North-Holland 2016 Nuclear instruments & methods in physics research. Vol.831 No.-
A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor ''Origami'' method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.