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The Belle II silicon vertex detector: Assembly and initial results
Thalmeier, R.,Casarosa, G.,Schwanda, C.,Aihara, H.,Aziz, T.,Bacher, S.,Bahinipati, S.,Barberio, E.,Baroncelli, Ti.,Baroncelli, To.,Basith, A.K.,Batignani, G.,Bauer, A.,Behera, P.K.,Bertacchi, V.,Betta Elsevier 2019 Nuclear Instruments & Methods in Physics Research. Vol.936 No.-
<P><B>Abstract</B></P> <P>The “chip-on-sensor” concept of this detector minimizes the distance of the signal propagation from the double-sided silicon detector strips to the readout chips and thus reduces noise from strip capacitance. One half of the detector is built, the second half is being assembled at the time of writing. Prototypes have been tested in several test beams as well as in the so-called Phase 2 setup inside the detector structure. First results from a commissioning run of the Belle-II prototype SVD detector are presented. The measured signal-to-noise and timing performance are found to be according to design specifications.</P> <P><B>Highlights</B></P> <P> <UL> <LI> The Belle-II Silicon Vertex Detector is based on a “chip-on-sensor” concept. </LI> <LI> One half of the detector is built, the second half is being assembled. </LI> <LI> Prototypes have been tested in a commissioning run inside the detector structure. </LI> <LI> The measured SNR and hit time are found to be according to design specifications. </LI> </UL> </P>
The Belle II SVD data readout system
Thalmeier, R.,Adamczyk, K.,Aihara, H.,Angelini, C.,Aziz, T.,Babu, V.,Bacher, S.,Bahinipati, S.,Barberio, E.,Baroncelli, Ti.,Baroncelli, To.,Basith, A.K.,Batignani, G.,Bauer, A.,Behera, P.K.,Bergauer, Elsevier BV * North-Holland 2017 Nuclear Instruments & Methods in Physics Research. Vol. No.
<P><B>Abstract</B></P> <P>The Belle II Experiment at the High Energy Accelerator Research Organization (KEK) in Tsukuba, Japan, will explore the asymmetry between matter and antimatter and search for new physics beyond the standard model.</P> <P>172 double-sided silicon strip detectors are arranged cylindrically in four layers around the collision point to be part of a system which measures the tracks of the collision products of electrons and positrons. A total of 1748 radiation-hard APV25 chips read out 128 silicon strips each and send the analog signals by time-division multiplexing out of the radiation zone to 48 Flash Analog Digital Converter Modules (FADC).</P> <P>Each of them applies processing to the data; for example, it uses a digital finite impulse response filter to compensate line signal distortions, and it extracts the peak timing and amplitude from a set of several data points for each hit, using a neural network.</P> <P>We present an overview of the SVD data readout system, along with front-end electronics, cabling, power supplies and data processing.</P>
The Belle II silicon vertex detector assembly and mechanics
Adamczyk, K.,Aihara, H.,Angelini, C.,Aziz, T.,Babu, V.,Bacher, S.,Bahinipati, S.,Barberio, E.,Baroncelli, Ti.,Baroncelli, To.,Basith, A.K.,Batignani, G.,Bauer, A.,Behera, P.K.,Bergauer, T.,Bettarini, Elsevier BV * North-Holland 2017 Nuclear Instruments & Methods in Physics Research. Vol. No.
<P><B>Abstract</B></P> <P>The Belle II experiment at the asymmetric SuperKEKB collider in Japan will operate at an instantaneous luminosity approximately 50 times greater than its predecessor (Belle). The central feature of the experiment is a vertex detector comprising two layers of pixelated silicon detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). One of the key measurements for Belle II is CP violation asymmetry in the decays of beauty and charm hadrons, which hinges on a precise charged-track vertex determination and low-momentum track measurement. Towards this goal, a proper assembly of the SVD components with precise alignment ought to be performed and the geometrical tolerances should be checked to fall within the design limits. We present an overview of the assembly procedure that is being followed, which includes the precision gluing of the SVD module components, wire-bonding of the various electrical components, and precision 3D coordinate measurements of the final SVD modules.</P> <P>Finally, some results from the latest test-beam are reported.</P>
Belle II silicon vertex detector
Belle II-SVD Collaboration,Adamczyk, K.,Aihara, H.,Angelini, C.,Aziz, T.,Babu, V.,Bacher, S.,Bahinipati, S.,Barberio, E.,Baroncelli, Ti.,Baroncelli, To.,Basith, A.K.,Batignani, G.,Bauer, A.,Behera, P. North-Holland 2016 Nuclear Instruments & Methods in Physics Research. Vol.831 No.-
The Belle II experiment at the SuperKEKB collider in Japan is designed to indirectly probe new physics using approximately 50 times the data recorded by its predecessor. An accurate determination of the decay-point position of subatomic particles such as beauty and charm hadrons as well as a precise measurement of low-momentum charged particles will play a key role in this pursuit. These will be accomplished by an inner tracking device comprising two layers of pixelated silicon detector and four layers of silicon vertex detector based on double-sided microstrip sensors. We describe herein the design, prototyping and construction efforts of the Belle-II silicon vertex detector.
Belle-II VXD radiation monitoring and beam abort with sCVD diamond sensors
Adamczyk, K.,Aihara, H.,Angelini, C.,Aziz, T.,Babu, V.,Bacher, S.,Bahinipati, S.,Barberio, E.,Baroncelli, T.,Basith, A.K.,Batignani, G.,Bauer, A.,Behera, P.K.,Bergauer, T.,Bettarini, S.,Bhuyan, B.,Bil Elsevier 2016 Nuclear instruments & methods in physics research. Vol.824 No.-
<P><B>Abstract</B></P> <P>The Belle-II VerteX Detector (VXD) has been designed to improve the performances with respect to Belle and to cope with an unprecedented luminosity of 8 × <SUP> 10 35 </SUP> <SUP> cm − 2 </SUP> <SUP> s − 1 </SUP> achievable by the SuperKEKB. Special care is needed to monitor both the radiation dose accumulated throughout the life of the experiment and the instantaneous radiation rate, in order to be able to promptly react to sudden spikes for the purpose of protecting the detectors. A radiation monitoring and beam abort system based on single-crystal diamond sensors is now under an active development for the VXD. The sensors will be placed in several key positions in the vicinity of the interaction region. The severe space limitations require a challenging remote readout of the sensors.</P>
Belle II SVD ladder assembly procedure and electrical qualification
Adamczyk, K.,Aihara, H.,Angelini, C.,Aziz, T.,Babu, Varghese,Bacher, S.,Bahinipati, S.,Barberio, E.,Baroncelli, T.,Basith, A.K.,Batignani, G.,Bauer, A.,Behera, P.K.,Bergauer, T.,Bettarini, S.,Bhuyan, Elsevier 2016 Nuclear instruments & methods in physics research. Vol.824 No.-
<P><B>Abstract</B></P> <P>The Belle II experiment at the SuperKEKB asymmetric <SUP> e + </SUP> <SUP> e − </SUP> collider in Japan will operate at a luminosity approximately 50 times larger than its predecessor (Belle). At its heart lies a six-layer vertex detector comprising two layers of pixelated silicon detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). One of the key measurements for Belle II is time-dependent CP violation asymmetry, which hinges on a precise charged-track vertex determination. Towards this goal, a proper assembly of the SVD components with precise alignment ought to be performed and the geometrical tolerances should be checked to fall within the design limits. We present an overview of the assembly procedure that is being followed, which includes the precision gluing of the SVD module components, wire-bonding of the various electrical components, and precision three dimensional coordinate measurements of the jigs used in assembly as well as of the final SVD modules.</P>
A bonding study toward the quality assurance of Belle-II silicon vertex detector modules
Belle-II SVD Collaboration,Kang, K.H.,Jeon, H.B.,Park, H.,Uozumi, S.,Adamczyk, K.,Aihara, H.,Angelini, C.,Aziz, T.,Babu, V.,Bacher, S.,Bahinipati, S.,Barberio, E.,Baroncelli, T.,Basith, A.K.,Batignani North-Holland 2016 Nuclear instruments & methods in physics research. Vol.831 No.-
A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor ''Origami'' method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.