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김대룡(Dai Ryong Kim),김용철(Yong Cheol Kim),금동욱(Dong Uk Keum) 한국수소및신에너지학회 1989 한국수소 및 신에너지학회논문집 Vol.1 No.1
Although it has been well known that many metal hydrides are promising to use for hydrogen storage and other applications, some difficulties still remain. Metal hydrides, particularly in powder form, have very poor thermal conductivity. The hydrogen storage alloys degrade intrinsically or extrinsically during repeated hydriding and dehydriding. Elimination of these problems is very important in the practical applications. In order to prevent degradation and to improve the thermal conductivity, the hydrogen storage characteristics of rare-earth type alloy encapsulated with Cu or Ni by means of chemical plating have been investigated. No changes has occured in hydrogen absorption capacity and equilibrium pressure even though the alloy powder is microencapsulated. The first hydrogen absorption rate of the alloy encapsulated increased considerably comparing to uncapsulated sample. In the case of encapsulating the fine powder (>10um) and subsequent compacting by 8ton/cm², shape of compact is maintained regardless of hydriding and dehydriding. The degree of degradation of the alloy caused by impurity gas of CO or O₂ was decre ased prominently by encapsulation.
(hfac)Cu(vtmos)의 액체분사법에 의한 TiN 기판상 구리박막의 유기금속 화학증착 특성
전치훈,김윤태,김대룡,Jun, Chi-Hoon,Kim, Youn-Tae,Kim, Dai-Ryong 한국재료학회 1999 한국재료학회지 Vol.9 No.12
We have carried out copper MOCVD(metalorganic chemical vapor deposition) onto the reactive sputtered PVD-TiN and rapid thermal converted RTP-TiN substrates using direct liquid injection for effective delivery of the (hfac)Cu(vtmos) [$C_{10}H_{13}O_{5}CuF_{6}$Si: 1,1,1,5,5,5-hexafluoro-2,4- pentadionato (vinyltrimethoxysilane) copper (I)] precursor. Especially, the influences of deposition conditions and the substrate type on growth rate, crystal structure, microstructure, and electrical resistivity of copper deposits have been discussed. It is found that the film growth with 0.2ccm precursor flow rate become mass-transfer controlled up to Ar flow rate of 200sccm and pick-up rate controlled at a vaporizer above 1.0Torr reactor pressure. The surface-reaction controlled region from 155 to 225$^{\circ}C$ at 0.6Torr reactor pressure results in the apparent activation energies of 12.7~14.1kcal/mol, and above 224$^{\circ}C$ the growth rate with $H_2$ addition could be improved compared to the pure Ar carrier. The Cu/RTP-TiN structures which have high copper nucleation density in initial stage of growth show more pronounced (111) preferred orientations and lower electrical resistivities than those on PVD-TiN. The variation of electrical resistivity with substrate temperature reflects the three types of film microstructure changes, showing the lowest value for the deposit at 165$^{\circ}C$ with small grains of good contacts. (hfac)Cu(vtmos) [$C_{10}H_{13}O_{5}CuF_{6}$Si: 1,1,1,5,5,5-hexafluoro-2,4- pentadionato (vinyltrimethoxysilane) copper (I)] 구리원을 액체분사법으로 공급하여 반응성 스퍼터 증착된 PVD-TiN과 급속열처리 변환된 RTP-TiN 기판상에 구리를 유기금속 화학증착법으로 성장시키고, 증착조건과 기판 종류가 박막의 증착율, 결정구조 및 미세조직, 전기비저항 등에 미치는 영향을 분석하였다. 구리원 유량 0.2ccm에서 증착반응은 Ar 유량 200sccm까지 물질전달 지배과정과 전압 1.0Torr 이상에서 기화기에서의 공급율속을 보였다. 전압 0.6Torr일 때 활성화에너지는 155~225$^{\circ}C$의 표면반응 지배영역에서 12.7~14.1kcal/mol의 값을 나타내었으며, 225$^{\circ}C$ 이상의 기판온도에서는 $H_2$ 첨가에 따른 증착율 개선이 간응한 것으로 판단되었다. 증착층은 기판온도 증가에 따라 3차원 island 양식으로 성장하였으며, 증착초기 구리 핵생성밀도가 큰 RTP-TiN상 증착층이 PVD-TiN상보다 현저한 (111) 우선방위와 낮은 전기비저항값을 나타내었다. 구리박막의 전기비저항은 결정립간 연결성이 양호한 165$^{\circ}C$에서 가장 낮았으며, 증착온도에 따른 박막 미세구조 변화로 인해 그 거동은 3개의 영역으로 구분되어 나타났다.
마이크로 캡슐화한 수소저장합금 분말 및 그 성형체의 수소흡수 · 방출 특성
김찬중(Chan Jung Kim),최병진(Byung Jin Choi),김대룡(Dai Ryong Kim) 한국수소및신에너지학회 1993 한국수소 및 신에너지학회논문집 Vol.4 No.1
The hydrogen absorption and desorption characteristics of microencapsulated (CFM)Ni<sub>4.7</sub>Al<sub>0.2</sub>Fe<sub>0.1</sub> and MmNi?Fe powder with Ni and/or Cu by means of chemical plating method have been investigated. Initial hydrogen absorption rate and activation property were increased remarkably by encapsulation and subsequent compacting. Pellets abtained by compacting of Cu-encapsulated fine powder have fairly good strength even after 30 cycles of hydriding and dehydriding. Encapsulated alloy powder and their compacts show a good resistance to degradation by O₂ or CO in hydrogen.
김찬중(Chan Jung Kim),김대룡(Dai Ryong Kim) 한국수소및신에너지학회 1999 한국수소 및 신에너지학회논문집 Vol.10 No.3
Recently Ni/MH secondary battery have been studied very extensively because of containing no pollutants as well as superior performance. However comparing to widely studying high capacity of hydrogen storage alloys electrode, the capacity of Ni electrode is inferior. Using for high capacity Ni/MH battery as a anodic materials, the study about high capacity Ni electrode is necessary. To making high capacity Ni electrode, active materials were impregnated in various polarization impregnation conditions. Plaque, milling for 6hr and sintered at 800℃ indicated porosity over 80%, and porosity were increased with proper condition electrochemical etching treatment. Proper impregnation condition was 40-80㎃/㎝, polarizing time was 5-10min.
수소용기내에서 수소저장합금 분말 성형체의 수소 흡수 및 방출 거동
김찬중(Chan Jung Kim),이재명(Jae Myoung Lee),김대룡(Dai Ryong Kim) 한국수소및신에너지학회 1995 한국수소 및 신에너지학회논문집 Vol.6 No.1
Hydrogen storage alloy powder compacts were prepared by using automatic press, with PTFE as a binder. Hydrogen absorption and desorption characteristics and thermal conducting property of the compacts were studied using test hydrogen cylinder, comparing with bare alloy powder. The compacts showed better rate capability and activation characteristics than bare powder. Effective thermal conductivity and diffusivity of the compact bed were 1.0X10<sup>-2</sup>W/cmK and 2.0X10<sup>-2</sup>cm²/s, respectively, which were similar to that of bare powder bed. A good rate capability of the compacts was interpreted in terms of hydrogen permeation rather than thermal conductivity in the beds.