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홍원표(W. P. Hong),최병열(B. Y. Choi),강은구(E. G. Kang),이석우(S. W. Lee),최헌종(H. Z. Choi) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.5
FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis and IC error correction, etc. Currently, FIB is not being applied to the fabrication of the micro and nano-structured mold, because of low productivity. And also sputtering rate has been required to fabricate 3D shape. In this paper, we studied the FIB-Sputtering rate according to mold materials. As well, surface roughness characteristics were analyzed for micro and nano mold fabrication. The micro Si wafer, GC (Glassy Carbon), STAVAX, and DLC that have been normally considered as good micro or nano mold materials were used in this study. The experiment object of waveguide mold is also applied to the DLC material.
홍원표(W. P. Hong),최병열(B. Y. Choi),강은구(E. G. Kang),이석우(S. W. Lee),최헌종(H. Z. Choi) 대한기계학회 2009 大韓機械學會論文集A Vol.33 No.3
FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis and IC error correction, etc. Currently, FIB is not being applied to the fabrication of the micro and nano-structured mold, because of low productivity. And also sputtering rate has been required to fabricate 3D shape. In the paper, we studied the FIB-Sputtering rate according to mold materials. And surface roughness characteristics had been analysed for micro or nano mold fabrication. Si wafer, Glassy Carbon, STAVAX and DLC that have been normally considered as good micro or nano mold materials were used in the study.