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최병열(B. Y. Choi),강은구(E. G. Kang),홍원표(W. P Hong),이석우(S. W. Lee),최헌종(H. Z. Choi) 한국생산제조학회 2005 한국공작기계학회 추계학술대회논문집 Vol.2005 No.-
The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. The target of this paper is the analysis of FIB sputtering process according to tilt angle, dwell time and overlap for application of 3D micro pattern fabrication and finds the effective beam scanning conditions using Taguchi approach. Therefore we make the conclusions that tilt angle is dominant parameter for sputtering yields Dwell Time are dominant parameters for sputtering accuracy.
홍원표(W. P. Hong),최병열(B. Y. Choi),강은구(E. G. Kang),이석우(S. W. Lee),최헌종(H. Z. Choi) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.5
FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis and IC error correction, etc. Currently, FIB is not being applied to the fabrication of the micro and nano-structured mold, because of low productivity. And also sputtering rate has been required to fabricate 3D shape. In this paper, we studied the FIB-Sputtering rate according to mold materials. As well, surface roughness characteristics were analyzed for micro and nano mold fabrication. The micro Si wafer, GC (Glassy Carbon), STAVAX, and DLC that have been normally considered as good micro or nano mold materials were used in this study. The experiment object of waveguide mold is also applied to the DLC material.
최헌종(H. Z. Choi),강은구(E. G. Kang),최병열(B. Y. Choi),이석우(S. W. Lee),홍원표(W. P. Hong) 한국생산제조학회 2006 한국공작기계학회 춘계학술대회논문집 Vol.2006 No.-
Recently, researcher relating to FIB technology have tried found another application to use the powerful specification in the point of below 10㎚ focused ion beam in diameter. In the paper, we focus the development of fabrication process and application for micro and nano structure manufacturing. Therefore we have carried out the experiments of FIB-sputtering according to with and without GAE and tilt angle, and FIB-CVD according to dwell time. From the results, we found the aspect ratio of pattern for FIB-Sputtering and FIB-CVD. And yield and minimum feature size characteristic could be analyzed according to tilt angle and dwell time, which are considered the dominant parameter.
홍원표(W. P. Hong),최병열(B. Y. Choi),강은구(E. G. Kang),이석우(S. W. Lee),최헌종(H. Z. Choi) 대한기계학회 2009 大韓機械學會論文集A Vol.33 No.3
FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis and IC error correction, etc. Currently, FIB is not being applied to the fabrication of the micro and nano-structured mold, because of low productivity. And also sputtering rate has been required to fabricate 3D shape. In the paper, we studied the FIB-Sputtering rate according to mold materials. And surface roughness characteristics had been analysed for micro or nano mold fabrication. Si wafer, Glassy Carbon, STAVAX and DLC that have been normally considered as good micro or nano mold materials were used in the study.
강은구(E.G. Kang),최병열(H.Z. Choi),홍원표(B.Y. Choi),이석우(W.P. Hong),최헌종(S.W. Lee) 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of Φ 10㎚ and smaller is available. Currently FIB is not being applied in the fabrication of this micro part because of some problems to redeposition and charging effect of the substrate causing reduction of accuracy with regards to shape and productivity. Furthermore, the prediction of the material removal rate information should be required but it has been insufficient for micro part fabrication. The paper have the targets that are FIB-CVD characteristic analysis and minimum line pattern resolution achievement for 3D micro fabrication. We make conclusions with the analysis of the results of the experiment according to beam current, pattern size and scanning parameters. CVD of 8 pico ampere shows superior CVD yield but CVD of 1318 pico ampere shows the pattern sputtered. And dwell time is dominant parameter relating to CVD yield.