초청논문 : 고용체합금에서 슬립거동에 미치는 합금원소의 영향

홍순익 ( Sun Ig Hong ) 대한금속재료학회 ( 구 대한금속학회 ) 1994 재료강도 심포지엄 Vol.- No.-

등통로각압축공정을 이용하여 제작된 Cu-15wt.%Ag 미세복합재료의 미세구조 및 기계적, 전기적 특성

홍순익 ( Sun Ig Hong ),조규진 ( Kyu Jin Cho ) 대한금속재료학회(구 대한금속학회) 2011 대한금속·재료학회지 Vol.49 No.2

Equal channel angular pressing (ECAP) with intermediate heat treatment was employed to optimize the strength of Cu-15 wt.%Ag. Changes in microstructure, electrical properties and mechanical properties were studied as a function of pressing methods and heat treatment. ECAPed Cu-15wt.%Ag exhibited ultrafine-grained microstructures with the shape and distribution of Ag-rich lamellae dependent on the processing routes. For route A in which the sample was pressed without rotation between each pass, the initial dendrites of Ag-rich phase were elongated along the shear direction and developed into elongated filaments. For route C in which the sample was rotated by 180 degree after each pass, the morphology of initial dendrites of Ag-rich phase was not much modified and the networked structure remained even after 8 passes of ECAP. For route Bc in which the sample was rotated by 90 degree after each pass, the initial dendrites became finer by fragmentation with no pronounced change of the shape and distribution of Ag-rich lamellae. The strength of Cu-15wt.%Ag ECAPed using route Bc was found to be greater than those ECAPed using route A, suggesting that the substructural strengthening is more effective in strengthening than the interface strengthening.

ITO층의 두께에 따른 ITO/PET sheet의 변형거동 및 균열 형성 거동

김진열,홍순익,Kim, Jin-Yeol,Hong, Sun-Ig 한국재료학회 2009 한국재료학회지 Vol.19 No.1

In this study, the stress-strain response and the cracking behaviors of ITO film on a PET substrate are investigated. The cracking behaviors of ITO thin films deposited on a thermoplastic semi-crystalline polymer developed for flexible display applications was investigated by means of tensile experiments equipped with an electrical measurement apparatus and an in-situ optical microscope. Electrical resistance increased gradually in the elastic-to-plastic transition region of the stress strain curves and cracks formed. Numerous cracks were found in this region, and the increase of the resistance was linked to the cracking of ITO thin films. Upon loading, the initial cracks perpendicular to the tensile axis were observed at about 1% of the total strain. They propagated to the entire sample width as the strain increased. The spacing between the horizontal cracks is thought to be determined by the fracture strength and the thickness of the ITO film as well as by the interfacial strength between the ITO and PET. The effect of the strain rate on the cracking behavior was also investigated. The crack density increased as the strain increased. The spacing between the horizontal cracks (perpendicular to the stress axis) increased as the strain rate decreased. The increase of the crack density as the strain rate decreased can be attributed to the higher fraction of the plastic strain to the total strain at a given total strain. The higher critical strain for the onset of the increase in the resistance and the crack initiation of the ITO/PET with a thinner ITO film (300 ohms/sq.) suggests a higher strength of the thinner ITO film.

다발체형성과 인발공정에 의해 제조된 Cu-Nb 미세복합재료의 미세조직과 전도도

권회준,홍순익,지광구,Kwon, Hoi-Joon,Hong, Sun-Ig,Jee, Kwang-Koo 한국재료학회 2001 한국재료학회지 Vol.11 No.2

다발체형성 제조기술을 이용하여 심하게 인발가공된 Cu-Nb 미세복합재료 전선의 전기적 특성과 열처리에 따른 미세조직 변화와의 관계에 대하여 연구하였다. 다발체형성과 인발공정에 의해 제조된 전선에서 Nb필라멘트 단면방향의 형태는 직선이거나 약간 굽은 형태로 나타났다 Nb필라멘트 형태의 차이는 고온에서의 다발체형성 제조공정중의 Nb필라멘트의 파손과 실린더화에 의해 발생하였다. Cu-Nb 미세복합재료의 비저항은 Cu-Nb 계면에서의 전자 산란에 의해 주로 결정된다. $400^{\circ}C$의 어닐링온도 이하에서 전도도의 감소는 침상형태 석출물의 정합변형율과 관계된 산란의 기여가 증가하기 때문이다. 비저항의 비 ($\rho_{295K}$/$\rho_{75K}$)의 약간의 감소는 또한 Nb원자의 석출 때문이다. 50$0^{\circ}C$의 어닐링온도에서 Cu-Nb 미세복합재료의 전도도 중가는 Nb필라멘트의 조대화와 구형화때문이다 The electrical properties of heavily drawn bundled Cu- Nb filamentary microcomposite wires were examined and correlated with the microstructural changes caused by thermomechanical treatments. The cross sectional shape of Nb filaments in wires fabricated by bundling and drawing appear straight or slightly curved. The different shape of Nb filaments is attributed to the break- up and cylinderization of Nb filaments during the bundling process at high temperatures. The resistivity of Cu-Nb microcomposites is predominantly controlled by electron scattering at Cu-Nb interfaces. The decrease of the conductivity below the annealing temperature of $400^{\circ}C$ is due to the increasing contribution of the scattering associated with coherency strains of needle- shaped precipitates. The slight decrease of the resistivity ratio (${\rho}_{295K}/{\rho}_{75K}$) is also due to the precipitation of Nb atoms. The increase in conductivity in Cu-Nb microcomposites at an annealing temperature of 50$0^{\circ}C$ is due to the coarsening and spheroidization of Nb filaments.

Zr-Ti-Cu-Ni-Be 합금으로 제조된 상용 골프클럽헤드의 부위별 물리적 특성 및 기계적 거동

최영철,홍순익,Choi, Young-Chul,Hong, Sun-Ig 한국재료학회 2005 한국재료학회지 Vol.15 No.11

The deformation behavior of a bulk amorphous and crystallized amorphous $Zr_{22.5}Ti_{14}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy extracted from a commercial golf club head was characterized at room temperature ana $300^{\circ}C$. At room temperature, amorphous specimens revealed higher yield stress and ductility than partially crystallized alloy specimens. Amorphous alloy displayed some plasticity before fracture, which resulted from strain hardening and repeated crack initiation and propagation. The fracture is mainly localized on one major shear band, and the compressive fracture angle of the amorphous specimen between the stress axis and the fracture plane was about $40^{\circ}$ Scanning electron microscope observations revealed mainly a vein-like structure in the amorphous alloy But the fracture surface of partially crystallized amorphous alloy consisted of vein-like and featureless fracture structure. The partially crystallized alloy extracted from the thick part of the club fractured in the elastic region, at a much lower stress level than the amorphous, suggesting that relatively coarse crystal particles formed during cooling cause the brittle fracture.

면저항 45 ohms/sq.의 ITO/PET Sheets의 변형률 속도에 따른 균열 형성 거동

김진열,홍순익,Kim, Jin-Yeol,Hong, Sun-Ig 한국전기전자재료학회 2009 전기전자재료학회논문지 Vol.22 No.1

The stress-strain behavior and its effects on the crack initiation and growth of ITO film on PET substrate with a sheet resistance of 45 ohms/sq were investigated. Electrical resistance increased gradually at the strain of 0.7% in the elastic to plastic transition region of the stress strain curves. Numerous cracks were observed after 1% strain and the increase of the resistance can be linked to the cracking of ITO thin films. The onset strain for the increase of resistance increased with increasing strain rate, suggesting the crack initiation is dependent on the strain rate. Upon loading, the initial cracks perpendicular to the tensile axis were observed and propagated the whole sample width with increasing strain. The spacing between horizontal cracks is thought to be determined by the fracture strength and the interfacial strength between ITO and PET. The crack density increased with increasing strain. The spacing between horizontal cracks (perpendicular to the stress axis) increased with decreasing strain rate, The increase of crack density with decreasing strain rate can be attributed to the higher fraction of the plastic strain to the total strain at a given total strain. As the strain increased over 5% strain, cracks parallel to the stress axis were developed and increased in number with strain, accompanied by drastic increases of resistance.

Cu₅₅Zr₃₀Ti₁₀Pd₅ 비정질 합금의 기계적 거동

최원욱,김형섭,홍순익,Choi Won Wook,Gato H.,Kim Hyoung Seop,Hong Sun Ig,Inoue A. 한국재료학회 2005 한국재료학회지 Vol.15 No.4

Room and high temperature deformation behaviors of Cu-Zr-Ti-Pd bulk metallic glasses produced by copper mold casting were investigated. The addition of Pd was shown to enhance the glass forming ability and thermal stability of Cu-Zr-Ti base bulk metallic glass. The compressive strength of $Cu_{55}Zr_{30}Ti_{10}Pd_5$ bulk metallic glass was 2230 MPa with 1.8 plastic strain. The stress overshoot and yield drop phenomenon were observed below $487^{\circ}C$ and a drastic decrease in the flow stress was observed at $487^{\circ}C$. The stress overshoot is thought to be associated with stress-induced structural relaxation.

생체유사환경에서 성장된 아파타이트 층의 나노구조 연구

김정,이갑호,홍순익,Kim, Joung,Lee, Kap-Ho,Hong, Sun-Ig 한국재료학회 2005 한국재료학회지 Vol.15 No.11

The ultrastructure ore of a nanostructured apatite film nucleated from solution was studied to gain insights into that of bone minerals which is the most important constituent to sustain the strength of bones. Needle-shaped apatite crystal plates with a bimodal size distribution $(\~100\;to\;\~1000 nm)$ were randomly distributed and they were found to grow parallel to the c-axis ([002]), driven by the reduction of surface energy. Between these randomly distributed needle-shaped apatite crystals which are parallel to the film, apatite crystals (20-40nm) with the normal of the grains quasi-perpendicular to the c-axis were observed. These observations suggest that the apatite film is the interwoven structure of apatite crystals with the c-axis parallel and quasi-perpendicular to the fan. In some regions, amorphous calcium phosphate, which is a precursor of apatite, was also observed. In the amorphous phase, small crystalline particle with the size of 2-3 nm were observed. These particles were quite similar, in size and shape, to those observed in the femoral trabecular bone, suggesting the nucleation of apatites by a biomimetic process in vitro is similar to that in vivo.

ECAP 공정을 이용한 분말의 치밀화

윤승채,서민홍,홍순익,김형섭,Yoon Seung-Chae,Seo Min-Hong,Hong Sun-Ig,Kim Hyoung-Seop 한국분말야금학회 2006 한국분말재료학회지 (KPMI) Vol.13 No.2

In recent years, equal channel angular pressing (ECAP) has been the subject of intensive study due to its capability of producing fully dense samples having a ultrafine grain size. In this paper, the ECAP process was applied to metallic powders in order to achieve both powder consolidation and grain refinement. In the ECAP process for solid and powder metals, knowledge of the internal stress, strain and strain rate distribution is fundamental to the determination of the optimum process conditions for a given material. The properties of the ECAP processed solid and powder materials are strongly dependent on the shear plastic deformation behavior during ECAP, which is controlled mainly by die geometry, material properties, and process conditions. In this study, we investigated the consolidation, plastic deformation and microstructure evolution behaviour of the powder compact during ECAP.

Mechanical properties of 3-layer Cu-Ni-Zn/Cu-Cr/Cu-Ni-Zn alloy joined by roll-bonding

Ho Byung Kim(김호병),Sun Ig Hong(홍순익) 한국소성가공학회 2013 한국소성가공학회 학술대회 논문집 Vol.2013 No.10