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Supercritical Nano-Plating 시스템에서 전기도금된 니켈 막의 표면특성에 관한 연구
홍교민,김문선,정재관 한국공업화학회 2003 응용화학 Vol.7 No.2
In this study, experiments of a nickel electroplating were performed in a supercritical nano-plating(SCNP) system using CO₂as a supercritical fluid. Surface properties of nickel film electroplated by the electrolyte solution with 0.2 vol% surfactant and volume ratio of CO₂and electrolyte as 1:9 was the best in the plating properties, where surface roughness(Ra) of nickel film plated for 30 min by SCNP was 0.021 ㎛. The property of plated film with this new method was better than that by a conventional method.
Supercritical nano-plating 시스템에서 전해질/계면활성제 조성이 니켈 전기도금에 미치는 영향에 관한 연구
홍교민,김문선,정재관 한국공업화학회 2003 응용화학 Vol.7 No.1
In this study, experiments of a nikel elecroplating were performed in a supercritical nano-plating system using CO_2 as a supercritical fluid. Electrolyte and surfactant were important parameters on the nickel plating proces. Resistivity values decreased 60, 35, and 22 at 20, 30, and 50 wt% electrolyte, respectively, and over 60 wt%, the resistivity value was kept constant at 20. Surface properties of nickel film electroplated by the 60 wt% electrolyte solution with 2 wt% surfactant. The weight ratio of CO_2 and electrolyte as 1:9 was better then any other ratio in the plating properties.
CO_2 초임계 유체/전도성 에멀젼용액을 이용한 구리판에 대한 니켈 나노도금에 관한 연구
홍교민,홍성철,김문선,정재관 한국공업화학회 2002 응용화학 Vol.6 No.2
In this study, experiments of a nickel elecroplating were performed by a conductive emulsion solution of CO_2/electrolyte/surfactant/entrainer in the supercritical nanoplating system to investigate the effect of the resistivity on plating properties. Resistivity values decreased 60, 35, and 22 Ω at 20, 30, and 50 wt% electrolyte, respectively, and over 60 wt%, the resistivity value was kept constant at 20 Ω. Surface properties of nickel film electroplated by the emulsion solution with 60 wt% electrolyte at 8 MPa was better than that at atmospheric pressure.
수용액에서 γ형 알루미나 표면에 대한 니켈이온(Ⅱ)의 흡착특성
홍교민,김문선,정재관 한국공업화학회 2003 공업화학 Vol.14 No.3
γ형 알루미나의 흡착특성을 구명하기 위하여 본 실험에서는 수용액에서 γ형 알루미나를 흡착제로 이용하여 온도와 pH가 니켈이온(Ⅱ)의 흡착능에 미치는 영향을 관찰하고 알루미나 표면과 니켈이온(Ⅱ) 간의 Langmuir와 Freundlich 흡착등온식과 Lagergren 흡착속도식을 결정했다. 5 g Al_2O_3/L의 조건에서 니켈이온은 10 h에 흡착평형상태에 도달했다. PH 2~6의 범위에서 pH가 증가할 때 흡착량은 급격히 증가하다가 PH 6에서 최대 흡착량을 나타냈으며 pH 6~9의 범위에서는 pH가 증가하여도 흡착량은 일정했다. 온도 20℃에서는 흡착량이 적었으나 30℃에서 급격히 흡착량이 증가하였으며 30~50 ℃의 범위에서는 온도 증가에 따라 흡착량이 완만하게 증가했다. Freundlich 흡착등온식의 결정계수는 0.9489로 Langmuir식의 0.9265보다 높았으며 Lagersen 흡착속도식에서의 k_ad값은 0.0023 h^-1으로 결정계수는 0.9497이였다. In this paper, Langmuir and Freundlich adsorption isotherms, and Lagergen adsorption rate were determined and the effect of temperature and pH on the adsorptivity of Ni(Ⅱ) ions were investigated in order t() stud)'the adsorption characteristics of γ-type alumina. For 5 g Al_2O_3/L, the adsorption equilibrium was obtained in 10 h. The adsorption amount increased rapidly when pH incrteased from 2 to 6, and the maximum adsorption amount was observed at pH 6. For pH 6 to 9, however, the adsorption amount remained constant. The adsorption amount was low at 20℃. However, The adsorption amount increased with increased in temperature; the amount increased rapidly at 30℃ and increased linearly with temperature from 30 to 50℃. The correlation coefficient (R_2) for Freundlich adsorption isotherm was 039489%, and this was higher than that for Langmuir adsorption isotherm of 0.9268%. The adsorption coefficient (k_ad) of lagergen equation was 0.0023h^-1, and the correlation coefficient (R^2) was 0.9497.
초임계 CO2에서 구리판에 대한 니켈 plating의 특성연구
홍교민 ( Hong Gyo Min ),정재관 ( Jeong Jae Gwan ) 한국공업화학회 2004 공업화학 Vol.15 No.3
초임계 이산화탄소를 용매로 사용하여 구리판에 대한 니켈 전기도금을 실시했다. 0.1 vol% 계면활성제 농도조건에서 에멀젼 용액의 전도도가 가장 높았으며 이산화탄소의 농도는 50 vol% 이하에서 저항값이 가장 낮았다. 45 ℃, 160 atm 조건에서 니켈도금막의 분산상태가 가장 양호했다. 초임계 이산화탄소에서 도금된 니켈막은 고유한 니켈 결정구조를 가지고 있었고 도금시간이 증가함에 따라 니켈 도금막의 표면은 점점 평활해졌다. 80~160 atm의 압력조건에서 표면경도는 135~164 ㎏/㎠로 압력에 따라 증가했는데 45 ℃, 80 atm에서 도금한 니켈막의 경도가 45 ℃, 1 atm에서 습식법에 의해 도금된 니켈막보다 130% 높았다. SCNP 시스템에서 니켈도금막의 분산상태를 양호하게 유지하기 위해서는 에멀젼 용액의 분산성이 개선되어야 하며 압력이 높을수록 니켈도금막 표면의 평활성과 경도가 향상되었다. Nickel electroplating was performed on the copper substrate by using supercritical carbon dioxide as a solvent. Conductivity of the emulsion solution was the highest at 0.1 vol% surfactant concentration and resistance value was the lowest at concentration lower than 50 vol5 CO_(2). The dispersion property of the nickel film plated at 45 ℃ and 160 atm was better than at any other temperature and pressure. The nickel film plated with SCNP system had the peak pattern of a typical nickel crystal structure. The surface roughness of nickel film was smoothed with an increasing plating time. Hardness value of the nickel film increased from 135 to 164 kg/cm^(2) with increased pressure from 80 to 160 atm; at 45 ℃ and 80 atm the value was higher by 130% than that at 45 ℃ and 1 atm by a conventional method. The dispersion property of emulsion solution must be enhanced in order to get the dispersion state of the nickel film plated with SCNP system. Smoothness and hardness properties of nickel film were enhanced by increasing pressure.
Cephalosporin C의 효율적인 고농도 생산을 위한 공정최적화 연구
김문선,홍교민,이상준,김진욱,신상규,이용철,김남기 한국EHS평가학회 2003 한국EHS평가학회지 Vol.1 No.1
This experment was performed to enhance the yield of cephalosporin C with high concentration. At pH 5.5, the yield was best and especially, it was by over 30% better with added AN910SH and a centrifugal separator. With 5.5% methanol as an elution solvent, it was more effective in both yield and economic.