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정일호,서상원,장봉기,Jung, Il Ho,Seo, Sang Won,Jang, Bong Ki 한국품질경영학회 2017 품질경영학회지 Vol.45 No.3
Purpose: The purpose of this study is to analyze quality control strengthening pilot project in development stages of weapon systems which ensures zero-defect. In order to achieve that, we propose collaboration support system between related organizations. Methods: First, we analyze how quality control methods has been developed from reviewing the preliminary study in commercial and defense industry. Then, we suggest improvement plans for quality control in defense industry and propose a pilot study which able to improve the recognized problems. Results: The results of this study ensures the participants in defense industry recognize the importance of quality control and form a consensus by sharing a case study. Finally, we propose the standardized work process by utilizing manual and manpower dispatching. Conclusion: As a result, this study clarifies the scope and role of relevant organizations to achieve the defense quality assurance in the total life cycle(TLC). Also, this paper guides the collaboration system between the relevant organization which differs from the commercial industry currently divided into development-production-quality.
3차원 패키징용 TSV의 열응력에 대한 열적 전기적 특성
정일호,기세호,정재필,Jeong, Il Ho,Kee, Se Ho,Jung, Jae Pil 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.2
Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.
다물체 동역학을 이용한 DC 모터 소음 저감에 관한 연구
정일호(Il-Ho Jung),박태원(Tae-Won Park),박지연(Ji-Yeon Park) 대한기계학회 2004 대한기계학회 춘추학술대회 Vol.2004 No.4
The DC Motor of a vehicle may cause noise and vibration due to high-speed revolution, which can make a driver feel uncomfortable. There have been various studies that attempted to solve these problems, mostly focusing on the causes of noise and vibration and the means of preventing them. The CAE methodology is more efficient than a real test for the purpose of looking for various design parameters to reduce the noise and vibration of the DC motor. In this study, a design process for reducing brush noise is presented with the use of a computer model, which is made by using a multi-body dynamics program (DADS). The design parameters to reduce the brush noise and vibration were proposed using a computer model. They were used to reduce the noise and vibration of a DC motor and verified by the test results of a fan DC motor in a vehicle. This method may be applicable to various DC motors.
기세호,신지오,정일호,김원중,정재필,Kee, Se-Ho,Shin, Ji-Oh,Jung, Il-Ho,Kim, Won-Joong,Jung, Jae-Pil 대한용접접합학회 2014 대한용접·접합학회지 Vol.32 No.3
TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.