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Thermal properties of nano fumed silica added epoxy adhesives for micro-assembly
이동현(Donghyun Lee),임지윤(Jiyun Lim),남승웅(Seungwoong Nam),김대흠(Daeheum Kim) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
For synthesis of adhesive material for micro-assemblys, epoxy adhesives that especially compounded with epoxy resins(YD-128, YDPN-638), hardner(Hexahydro-4-methylphthalic anhydride), catalyst(2-ethyl-4-methylimidazole) and filler(nano fumed silica) with ratios of Tg's of epoxy adhesives that cured at 120℃, for 2 hours were analyzed by DSC(Differential Scanning Calorimetry) and TGA(Thermogravimetrical Analyzer). Thermal property increases of epoxy adhesives were confirmed with increasing nano fumed silica contents.