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SOFC용 유리-세라믹섬유 복합기밀재의 고온 기체누설 거동
이재춘,권혁천,권영필,박성,장진식,이종호,김주선,이해원,Lee, Jae-Chun,Kwon, Hyuk-Chon,Kwon, Young-Pil,Park, Sung,Jang, Jin-Sik,Lee, Jongho,Kim, Joosun,Lee, Hae-Won 한국세라믹학회 2005 한국세라믹학회지 Vol.42 No.12
Glass composites containing ceramic fiber have been developed for Solid Oxide Fuel Cell (SOFC) seals. Effect of glass type, loading pressure and thermal cycle the leak rates of composite seals was investigated. Seal performance of two commercial glasses was compared with that of $SiO_2BaO-B_2O_3$ glass synthesized in this work. The leak rate for seals made of pyrex(R) increases from $\~0.0005\;to\;\~0.004sccm/cm$ as the gas pressure increases from 10 to 50 kPa. The soda lime silicate glass seal shows the leak rate two times higher than the one made of pyrex(R) or $SiO_2BaO-B_2O_3$ glass. The viscosity of glass at the seal test temperature is presumed to affect the leak rate of the glass seal. As the applied loading pressure increases from 0.4 to 0.8 MPa at $750^{\circ}C$, the leak rate decreases from 0.038 to 0.024 sccm/cm for composite seals. It has been found that during 50 thermal cycles between $450^{\circ}C\;to\;700^{\circ}C$ leak rates remained almost constant, ranging from 0.025 to 0.03sccm/cm. The results showed an excellent thermal cycle stability as well as sealability of the glass matrix ceramic fiber composite seals.
탄화규소 불투명화재와 세라믹섬유가 Fumed 실리카 단열재의 열전도도에 미치는 영향
권영필,권혁천,박성,이재춘,Kwon, Young-Pil,Kwon, Hyuk-Chon,Park, Sung,Lee, Jae-Chun 한국세라믹학회 2007 한국세라믹학회지 Vol.44 No.12
The thermal conductivities of nano-sized fumed silica-based insulation media were investigated by varying a mean particle size of the silicon carbide opacifiers and ceramic fiber content. Opacifying effect of ceramic fiber and silicon carbide powders was discussed in terms of their content and the mean particle size of them. As the fiber contents increased from 10 wt% to 30 wt% in a material, its thermal conductivity at temperatures of about $620^{\circ}C$ decreased from 0.171 $Wm^{-1}K^{-1}$ to 0.121 $Wm^{-1}K^{-1}$. Meanwhile, the thermal conductivity at temperatures of about $625^{\circ}C$ decreased from 0.128 $Wm^{-1}K^{-1}$ to 0.092 $Wm^{-l}K^{-1}$ as the mean SiC particle size decreased from $31{\mu}m$ to $10{\mu}m$.