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고국원(Kuk Won Ko),조수용(Soo-Yong Cho),김민영(Min Young Kim) 제어로봇시스템학회 2008 제어·로봇·시스템학회 논문지 Vol.14 No.6
As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 2π ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.
반도체 bump측정을 위한 고속 백색광 위상 간섭계 개발
고국원(Kuk Won Ko),심재환(Jae Hwan Sim),노희진(Hee Jin No),고경철(Kyeng Chul Koh) 대한전기학회 2010 정보 및 제어 심포지엄 논문집 Vol.2010 No.10
21세기에 들어와 nano-technology 라고 하는 기술이 부각 되면서 현재 우리나라의 대표적인 산업분야인 반도체, MEMS, 디스플레이 산업분야에서 광부품의 미세가공의 영역이 커지고 있으며, 이러한 미세 부품들의 가공 상태는 부품들은 양산품의 질에 큰 영향을 주기 때문에 미세 부품의 결함 및 불량을 고속으로 3차원으로 검사할 수 있는 측정법이 필요하다. 본 연구에서는 반도체 bump을 고속으로 검사할 수 있는 대영역 백색광 간섭계 개발을 목표로 하여 백색광 주사 간섭계의 단점인 속도계선을 목표로 하여 반도체 부품 및 디스플레이 분야의 In-Line 장비에 적용할 수 있는 Sensor head 의 설계와 300㎛/sec속도를 가지는 고속의 Autofocusing 방법 개발과 In-Line 장비에 적합한 40㎛/sec의 속도를 가지는 고속 측정 방식에 대하여 연구하였다.
Wire bonding 자동 전단력 검사를 위한 wire의 3차원 위치 측정 시스템 개발
고국원(Kuk Won Ko),김동현(Dong Hyun Kim),이지연(Jiyeon Lee),이상준(Sangjoon Lee) 제어로봇시스템학회 2015 제어·로봇·시스템학회 논문지 Vol.21 No.12
The bond pull test is the most widely used technique for the evaluation and control of wire bond quality. The wire being tested is pulled upward until the wire or bond to the die or substrate breaks. The inspector test strength of wire by manually and it takes around 3 minutes to perform the test. In this paper, we develop a 3D vision system to measure 3D position of wire. It gives 3D position data of wire to move a hook into wires. The 3D measurement method to use here is a confocal imaging system. The conventional confocal imaging system is a spot scanning method which has a high resolution and good illumination efficiency. However, a conventional confocal systems has a disadvantage to perform XY axis scanning in order to achieve 3D data in given FOV (Field of View) through spot scanning. We propose a method to improve a parallel mode confocal system using a micro-lens and pinhole array to remove XY scan. 2D imaging system can detect 2D location of wire and it can reduce time to measure 3D position of wire. In the experimental results, the proposed system can measure 3D position of wire with reasonable accuracy.