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- 저자 : ( Cheng-en Hsieh ) (검색결과 2 건)
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( Cheng-en Hsieh ),( Yuh-ming Hwu ),( Sheng-hsiang Li ),( Chung-hao Lu ),( Ming-huei Lin ),( Robert Kuo-kuang Lee ) 대한산부인과학회 2016 대한산부인과학회 학술대회 Vol.102 No.-
Objective: To investigate the effect of vascular endothelial growth factor (VEGF) and fibroblast growth factor 2 (FGF2) on revascularization, survival, and oocyte quality of cryopreserved, subcutaneously transplanted mouse ovarian tissue. Methods: Outbred ICR mice (n = 112) were used as the animal model. Vitrified mouse ovarian tissues were treated without (control group) or with VEGF and FGF2 before autologous subcutaneous transplantation. After transplantation for 2 or 3 weeks, grafts’ survival, angiogenesis, and oocyte quality were examined. Results: VEGF and FGF2 promoted revascularization and significantly increased the survival rate of subcutaneously transplanted cryopreserved ovarian tissues compared with the untreated grafted control. The two growth factors did not show long-term effects on the ovarian grafts. In contrast to the untreated ovarian grafts, active folliculogenesis was revealed as the number of various follicles was significantly higher or had an increased trend in the VEGF and FGF2-treated ones. Though the fertilization rate had no differences between VEGF/FGF2 and control group; however, the oocyte quality was much better in the VEGF/FGF2-treated grafts as demonstrated by the higher ratio of blastocyst development. Conclusions: Introducing of angiogenic factors such as VEGF and FGF2 may be a promising strategy to improve revascularization, survival, and oocyte quality of cryopreserved, subcutaneously transplanted mouse ovarian tissue.
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Cheng-En Ho,Wan-Zhen Hsieh,Tsung-Hsun Yang 대한금속·재료학회 2015 ELECTRONIC MATERIALS LETTERS Vol.11 No.1
The early stage of soldering reaction between Sn-3Ag-0.5Cu solderand ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu pad was investigatedby field-emission scanning electron microscopy (FE-SEM) inconjunction with field-emission electron probe microanalysis (FEEPMA)and high-resolution transmission electron microscopy(HRTEM). FE-SEM, FE-EPMA, and HRTEM investigationsshowed that Ni2SnP and Ni3P were the predominant P-containingintermetallic compounds (IMCs) in the soldering reaction and thattheir growth behaviors strongly depended on the depletion of Ni(P). The growth of Ni3P dominated over that of Ni2SnP in the earlystage of soldering, whereas the Ni3P gradually transformed intoNi2SnP after Ni(P) depletion. This Ni(P)-depletion-induced Ni2SnPgrowth behavior is different from the reaction mechanisms reported in the literature. Detailed analyses of the microstructuralevolution of the IMC during Ni(P) depletion were conducted, and a two-stage reaction mechanism was proposed to rationalizethe unique IMC growth behavior.
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