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열전달 및 압력강하 특성을 고려한 채널 내 핀-휜 구조물의 설계
신지영,손영석,이대영 대한설비공학회 2006 설비공학 논문집 Vol.18 No.6
Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.
신지영,손영석,김상민,이대영 대한설비공학회 2004 설비공학 논문집 Vol.16 No.7
Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cooling scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.
이승하(Seung-Ha Lee),곽규용(Kyu-Yong Kwak) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.11
Most military devices include the closed housing for the resistance of environment, passes on heat by conduction only. Wedge lock is a mechanical component to fix the Electronic Module assembled Electronic Device by using sliding mode. It protects the Electronic Module from external vibration and transfers the Electronic Module’s heat to outside. Therefore, it is very necessary to research the heating-characteristic of Wedge lock on conduction of the Electronic Module. Through our experiment, we confirm its heating-characteristic on unit load by using simulation tool such as ANSYS that recognizes conductive flow.
소형 휴대용 전자장비를 이용한 편리하고 경제적인 메카트로닉스 교육
강철구(Chul-Goo Kang) 대한기계학회 2015 대한기계학회 춘추학술대회 Vol.2015 No.6
최근에 기계공학 교육에서 메카트로닉스 교육의 중요성은 많이 인식되고 있으나, 일반적으로 장비가 갖춰진 실험실에서만 실험실습교육이 이루어지고 있어, 학생들이 집에서 실습해 볼 수 없는 불편함이 있어왔다. 본 논문에서는 5V 소형전원, 브레드보드, 마이크로컨트롤러 및 각종 전자칩류, 스텝모터, 전기소자류, LED 등 소형 휴대용장비와 학생의 PC를 활용하여, 디지털논리회로, 7-LED 구동, 사각파신호생성, 마이크로컨트롤러 어셈블리 및 C 프로그래밍, 타이머 인터럽트, 스텝모터 구동 등을 실험실습하는 교육에 대해 소개한다. 개발된 강좌에서는 내용강의와 더불어 실험실습을 병행하되, 학생들에게 편리하고 값싸게 실험실습을 수행할 수 있는 환경을 제공하여, 학생들이 집에서 실험실습을 예습 및 복습할 수 있게 하였다. Although mechatronics education in a mechanical engineering curriculum is recently recognized as important, its experimental education has been done generally in the laboratory equipped with all the apparatus and could not be done at home by students. This paper introduces experimental educations on mechatronics, e.g., digital logic circuits, 7-segment LED drive, square wave generation, microcontroller programming using assembly and C languages, timer interrupt, and step motor drive using a small 5 V power supply, a breadboard, various electronic and electric components, a microcontroller and its programmer, a step motor, and a students PC. In the developed mechatronics course, experimental educations are scheduled in parallel with contents lectures together, and cheap and economic experimental environment is prepared for students in which students can easily practice experimental works in advance or later at home by themselves.
전자장비에서 벽면의 대류열방출 및 통기구의 효과를 고려한 3차원 자연대류 냉각
이관수,백창인,임광옥 대한기계학회 1995 대한기계학회논문집 Vol.19 No.11
The numerical simulation on the three-dimensional natural convection heat transfer in the enclosure with heat generating chip is performed, and the effects of convective heat loss and vents are also examined. The effects of the Rayleigh number and outer Nusselt number (Nu$_{0}$) on the maximum chip temperature and the fractions of heat loss from the hot surfaces are investigated. The results show that conduction through the substrate is dominant in heat dissipation. With the increase of Rayleigh number, heat dissipation through the chip surfaces increases and heat loss through the substrate decreases. Maximum dimensionless temperature with vents is found to decrease about 40% compared to the one without vents at Nu$_{0}$=0.l. It is also shown that effects of size and location of the vents are negligible.ble.
모바일 전자장비 냉각을 위한 micro-CPL의 열성능 해석
배찬효(C.H. Bae),김병기(B.G. Kim),서정세(J.S. Suh),황건(G. Hwang),문석환(S.H. Moon) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.11
As more high power wide band gap devices are being utilized, the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.
히트파이프 열교환기를 이용한 전자통신장비 콘솔의 냉각 기술에 관한 연구
최지훈(Jee-Hoon Choi),유성열(Seong-Ryoul Ryoo),성병호(Byung-Ho Sung),이정환(Jung-Hwan Lee),김종만(Jong-Man Kim),전지환(Ji-Hwan Chun),서명원(Myung-Won Suh),김철주(Chul-ju Kim) 한국유체기계학회 2006 유체기계 연구개발 발표회 논문집 Vol.- No.-
The fan is widely used to cool high heat flux generated as of the electronic communication device consoles. It, however, makes a lot of noises that interfere considerably with the operation environment. This study was conducted to obtain the cooling design technology of the consoles through being equipped with the Heat Pipe Heat Exchangers (HPHE) together with low revolution fans in place of existing fans for the cooling technology of the forced convection. Not only the sealed type consoles but the HPHE were also designed so as to cool effectively the heat generated from the inside of the console. The simulation was conducted by computational numerical analysis along with its experiments. The results of the numerical analysis and experiments were compared in order to improve the cooling technology of the consoles mounted with the HPHE. Consequently, instead of loud fan noise generated as of existing forced convection methods, the cooling technology of HPHE can remarkably improve many problems such as the operation environment, indoor dust, malfunction caused by pollution sources and so on.
김수현(Su Hyeon Kim),이용덕(Yong Duck Lee) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.11
This paper presents the characteristics of heat spreading in a flat heat spreader. Two states of natural and forced convections are tested experimentally. A flat heat spreader consists of a wick structure, vapor passage, working fluid and cases. To fabricate a flat heat spreader with 1.5mm in thickness, two 200 screen mesh layers, one 14 screen mesh layer and cases made of a copper are used. Water is used as a working fluid. The thermal characteristics of a flat heat spreader are studied according to various input power in the natural and forced convections. In addition, the thermal characteristics of a flat heat spreader are compared with that of a copper plate. The results indicate that thermal characteristics of a flat heat spreader are much better than that of a copper plate in the natural and forced convection.