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Ju Seok Lee,Sungmin Kim,Sumin Park,Kyungryun Kim,Mijung Cho,Eunsil Kim,Jin Kyo Jung,Jeong-Dong Lee,Jung-Kyung Moon,Namshin Kim,Soon-chun Jeong,Sungtaeg Kang 한국육종학회 2015 한국육종학회 심포지엄 Vol.2015 No.07
Foxglove aphid, Aulacorthum solani (Kaltenbach), is a Hemipteran insect that infected a wide variety of plants worldwide and caused serious yield losses in crops. The foxglove aphid resistance gene, Raso2 was previously mapped from PI 366121 (Glycine soja Sieb. and Zucc.) to a 26cM marker interval on soybean chromosome 7. The development of additional genetic markers, which are mapped closer to Raso2 were required to accurately position the gene to improve the effectiveness of marker assisted selection. The objective of this study was to narrow down the putative QTL region, which is responsible to foxglove aphid resistance in PI366121 using recently developed high-density 180K Axiom SoyaSNP genotyping array. One hundred and forty one F8-derived F12 recombinant inbred lines developed from a cross of susceptible Williams 82 and resistant PI 366121, were used to generate a fine map of Raso2 interval. The phenotyping of antibiosis and antixenosis was done through choice and no-choice assays with total plant damage (TPD) and primary infestation leaf damage (PLD). The composite interval mapping analysis showed that the physical interval between two flanking makers, which was corresponding to Raso2, was narrowed down to 500kb on the Williams 82 genome assembly (Glyma2.0), instead of 4Mb in the previous report using Goldengate assay. In the Raso2 interval, there are about 60 candidate genes, including 4 of NBS-containing putative R genes. This result could be useful in breeding for new foxglove aphid resistant soybean cultivars.
Kim, Sumin,Kim, Hyun-Joong,Kim, Hee-Soo,Lee, Hwa Hyoung WILEY-VCH Verlag 2006 Macromolecular Materials & Engineering Vol.291 No.9
<P>Summary: The effects of bio-scavengers on the formaldehyde emission, bonding strength, curing behavior, and thermal decomposition properties of MF resins for engineered flooring and adhesion for wood were investigated. Four varieties of bio-scavengers, tannin powder, wheat flour, rice husk flour, and charcoal, were added to MF resin at 5 wt.-%. To determine formaldehyde emission and bonding strength, we manufactured engineered floorings. MF-charcoal was most effective in reducing formaldehyde emission because of its porous nature, but its bonding strength was decreased. Tannin powder and wheat flour, which contain more hydroxyl groups, showed higher bonding strength and curing degree than pure MF resin did. Although the hydroxyl groups of the bio-scavengers were effective in reducing formaldehyde emission and improve bonding strength and curing degree, rice husk flour and charcoal behaved like inorganic substances, thereby disturbing the adhesion between MF resin and wood and thus reducing the bonding strength. In thermogravimetric analysis, MF-tannin showed the highest thermal stability in the low-temperature range from 100 to 300 °C.</P><P> <img src='wiley_img/14387492-2006-291-9-MAME200600213-gra001.gif' alt='wiley_img/14387492-2006-291-9-MAME200600213-gra001'> Graphic Storage modulus (E′) of MF resin with various bio-scavengers at a heating rate of 10 °C · min<SUP>−1</SUP>. </P>
Mode matching telescope design and simulation for the EPR-SIPS experiment
Sumin Lee,Chang Hee Kim,Jimin Han,Sibilla Di Pace,V Sequino,Yunjong Kim,Changgon Kim,Hojae Ahn,Soojong Pak,Sungho Lee,Jaewan Kim,M Bawaj,M Barsuglia,M Bazzan,E Calloni,G Ciani,L Conti,B D’Angelo,M De 한국천문학회 2022 天文學會報 Vol.47 No.1
Kim, Jin-A,Kim, Sumin,Kim, Hyun-Joong,Kim, Yong-Shik Elsevier 2011 Journal of hazardous materials Vol.187 No.1
<P><B>Abstract</B></P><P>The aims of this study were to improve the emission test method for the 20L small chamber standardized in Korea using paints and to develop an optical test method for paints. The emission factors of the total volatile organic compounds (TVOC) and formaldehyde from oil-based paints, emulsion paints and water-dispersion paints coated at 300g/m<SUP>2</SUP> and cured for 24 (48)h were determined using the 20L small chamber method. The emission factors of TVOC and formaldehyde from all paints under steady state conditions were determined after 7 days with 24 (48)h of curing. The Korean standards require that paints be measured and analyzed on the third day after a test. However, the emission factors of TVOC and formaldehyde from the paints only began to stabilize 7 days after installing the samples. Until now, the emission test results have been reported mainly as concentration vs. time or emission factor vs. time profiles of TVOC and formaldehyde. The emission factors of the target volatile organic compounds (VOCs) and aldehyde types were obtained under specific test conditions according to the different coating weights. For all target volatile organic compounds and aldehyde types examined, the paint coating weight had an effect on emission.</P>
Optimization of Fe/Co ratio in Fe(87-x-y)CoxTi7Zr6By alloys for high saturation magnetization
Sumin Kim,Bo Kyeong Han,Duy-Truong Quach,Dong-Hyun Kim,Young Keun Kim,임혜인 한국물리학회 2016 Current Applied Physics Vol.16 No.5
We investigated a soft magnetic Fe(87-x-y)CoxTi7Zr6By (x ¼ 25, 30, 35 at.%, and y ¼ 2, 4 at.%) alloy system. The Fe-based amorphous materials have been studied because of excellent soft magnetic properties: high saturation magnetization and low coercivity. Especially, the FeeCo system has the high saturation magnetization in comparison to Fe-only and Co-only cases. In this research, we used an X-ray diffractometer, differential scanning calorimeter, vibrating sample magnetometer and high-temperature vibrating sample magnetometer in order to observe the properties of the FeeCoeTieZreB alloy system. One of the alloys showed the saturation magnetization of 1.67 T which is same as the highest value of Fe-based amorphous alloys. Furthermore, nanoindentation was performed to study the mechanical properties of this system. The highest and lowest values of nanoindentation hardness were 10.1 GPa and 8.2 GPa, respectively.
Kim, Jonghoon J.,Heegon Kim,Jung, Daniel H.,Sumin Choi,Jaemin Lim,Youngwoo Kim,Junyong Park,Hyesoo Kim,Dongho Ha,Bae, Michael,Joungho Kim IEEE 2017 IEEE transactions on electromagnetic compatibility Vol.59 No.4
<P>As the data rate of Low Power Double Data Rate 4 (LPDDR4) memory now exceeds 3.2 Gb/s, it is becoming more difficult to meet the target specifications. While testing has become of utmost importance, it is not viable to have a direct access to the signal pins in a package on package configuration due to the densely located array of solder balls; instead, a test interposer with an excellent electrical performance needs to be adopted to provide test access. In this paper, we first propose a novel test interposer scheme for testing LPDDR4 memory packages. For accurate testing without significant influence on the intrinsic signal path, the proposed test interposer is designed considering a number of signal integrity issues such as intersymbol interference, jitter, impedance matching, and crosstalk. Furthermore, by adopting silicone rubber sheet in place of soldering, the proposed test interposer enhances reusability of the packages with a fast setup time. Moreover, a reconstruction method is proposed that can reconstruct the voltage at application processor using the waveform captured on the test interposer, instead of probing at the ball gray array directly. Through a series of simulations and measurements, we experimentally verified the proposed test interposer. The proposed test interposer scheme can be widely adopted for testing of high-performance packages with its high accuracy and practicality.</P>