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RISS 인기검색어
- 검색키워드
- 저자 : Anmin Sun (검색결과 4 건)
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Effects of Sn Layer Orientation on the Evolution of Cu/Sn Interfaces
Menglong Sun,Zhangjian Zhao,Fengtian Hu,Anmin Hu,Ming Li,Huiqin Ling,Tao Hang 대한금속·재료학회 2018 ELECTRONIC MATERIALS LETTERS Vol.14 No.4
The effects of Sn layer orientation on the evolution of Cu/Sn joint interfaces were investigated. Three Sn layers possessing(112), (321) and (420) orientations were electroplated on polycrystalline Cu substrates respectively. The orientations of Snlayer preserved during reflowing at 250 °C for 10 s. After aging at 150 °C for different time, the interfacial microstructureswere observed from the cross-section and top-view. The alignment between the c-axis of Sn and Cu diffusion direction significantlysped up the Cu diffusion, leading to the thickest intermetallic compound layer formed in (112) joint. Two types ofvoids, namely, intracrystalline voids and grain islanding caused intercrystalline voids generated at Cu/Cu3Sn interfaces dueto the different interdiffusion coefficients of Cu and Sn (112) oriented Sn/Cu joint produced many more voids than (321)joint, and no voids were detected in (420) joint. Therefore, to enhance the reliability of solder joints, using (420) orientedSn as solder layer could be an efficient way.
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Yaqian Sun,Jing Wang,Xundi Zhang,Chenlin Yang,Anmin Hu,Tao Hang,Yunwen Wu,Huiqin Ling,Ming Li 대한금속·재료학회 2021 ELECTRONIC MATERIALS LETTERS Vol.17 No.6
At present, thermal compression bonding based on Cu and lead-free Sn based solder is often limited by high bonding temperature,which is higher than the melting point of solder (218 ℃). In this paper, we reported a low-temperature solid stateinsertion bonding method based on electroless Cu-Co-P micro-cones array. By adjusting the mass ratio of CuSO 4 ·5H 2 O andCoSO 4 ·7H 2 O, a series of Cu-Co-P micro-cones with diff erent morphologies were prepared. The Cu-Co-P micro-cones withhigher proportion of copper were sharper and denser and (111) orientation was also more. It was found that reducing theheight and density of micro-cones was conducive to achieve seamless bonding at lower temperature and force such as 170℃ and 750 gf. By optimizing the morphology of micro-cones, such as height, bottom diameter, vertex angle and density, theseamless and reliable bonding with high shear strength (39.9 MPa) could be achieved at 170 ℃ bonding temperature and1000 gf bonding force. The transmission electron microscopy results showed that intermetallic compounds including Cu 6 Sn 5and Cu 3 Sn existed at bonding interface, which indicated that signifi cant atomic diff usion had occurred between Cu-Co-Pmicro-cones and Sn based solder. Probable mechanisms for low-temperature insertion bonding were discussed.
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Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps
Siru Ren,Menglong Sun,Zebin Jin,Yukun Guo,Huiqin Ling,Anmin Hu,Ming Li 대한금속·재료학회 2019 ELECTRONIC MATERIALS LETTERS Vol.15 No.5
A new kind of intermetallic compounds (IMC) were found around copper pillar in micron level bumps. To investigate theformation mechanism, three different sized Sn/Ni/Cu bumps (10 μm, 20 μm, 50 μm) were electroplated then reflowed at230 °C for 100 s. After reflow process, a thin layer of IMC was formed around copper pillar, which is attributed to surfacewetting behavior. After aging at 170 °C and 200 °C for different times, the growth mechanism of sidewall IMC was observedby scanning electron microscopy combined with electron backscatter diffraction (EBSD) technology. Surface diffusion wasconsidered to be the main driving force for sidewall IMC growth for the activation energy of them was found to be muchsmaller than that in previous studies. The EBSD results showed a preferred orientation of sidewall Cu3Sngrains <100> beingperpendicular to copper periphery, which indicated direction of Cu atoms flux during Cu3Sngrowth. Formation mechanismof this novel sidewall IMC was proposed based on surface wetting and surface diffusion. The findings contribute to the failuremechanism study in small size bumps and provide insights into the reliability of 3D electronic packaging.
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Yuxin Wang,Guoping Yu,Anmin Sun,Xinghang Cai,Chonghui Yue 한국식품과학회 2015 Food Science and Biotechnology Vol.24 No.5
Effects of different hydrolytic conditions on functional ingredient contents and antioxidant activities of aqueous enzymatic extracts from rice bran (AEERB) were evaluated and correlations were determined. After trypsin hydrolysis under weak alkalescent conditions, the soluble protein, total phenolic, α-tocopherol, and γ-oryzanol contents of AEERB were increased. Excessively high temperatures (>60℃) and long hydrolysis times (>2.0 h) were not suitable for enzymatic hydrolysis. The free radical scavenging activity, ferric reducing/antioxidant power, lipid peroxidation inhibition activity, and total antioxidant activity were used for evaluation of the antioxidant activity. AEERB displayed an antioxidant activity and correlations of concentration levels of functional ingredients with antioxidant activity were significantly (p<0.05) positive.
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