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- 저자 : Yukun Guo (검색결과 3 건)
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Spatial Orientation of Indoor Fire Ignition Based on Monocular Vision and Virtual Scene
Yakun Xie,Jun Zhu,Yukun Guo,Dejun Feng,Dejun Feng 한국차세대컴퓨팅학회 2022 한국차세대컴퓨팅학회 학술대회 Vol.2022 No.10
The spatial orientation of fire ignition can support an automatic fire suppression system (AFSS). However, due to the ambiguity of 2D images, most of the existing methods tend to study fire detection and cannot carry out spatial orientation. To solve this problem, we propose a spatial orientation method of indoor fire ignition based on monocular vision and virtual scenes. First, a hierarchical virtual scene construction method is proposed to realize the rapid construction of indoor scenes. Second, the characteristics of the fire are analyzed to obtain fire ignition in a 2D image. Finally, the spatial orientation of indoor fire ignition is calculated by analyzing the characteristics of fire attachment and the principle of three-dimensional imaging. The experimental results show that the absolute error of the spatial orientation of our method is 10.27 cm, and the relative error is 4.08%, which can meet the needs of AFSS.
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Sun, YaNan,Lian, XinMing,Bo, YuKun,Guo, YuGuang,Yan, PeiShi Asian Australasian Association of Animal Productio 2017 Animal Bioscience Vol.30 No.2
Objective: The objective of this study was to investigate the effect of 20-day litter weight on behavior and heart rate variability (HRV) of piglets under stress. Methods: Forty four original litters were categorized as high litter weight (HW) litters (n = 22) and low litter weight (LW) litters (n = 22) by 20-day litter weight. From each original HW litter, three males and three females were randomly selected after weaning and the 12 piglets from two original litters with similar age of days were regrouped into one new high litter weight (NHW) litter (11 NHW litters in total). The original LW litters were treated with a same program, so that there were 11 new low litter weight (NLW) litters as well. The latencies to first fighting, fighting frequencies and duration within three hours were recorded after regrouping and the lesions on body surface within 48 hours were scored. Besides, HR (heart rate, bpm, beats per minute) and activity count (ACT), time domain indexes and frequency domain indexes of the piglets were measured in an isolation trial to analyze the discrepancy in coping with stress between the original HW and LW litters. Results: The results exhibited that piglets from the HW litters launched fighting sooner and got statistically higher skin lesion score than those from the LW litters (p = 0.03 and 0.02, respectively). Regarding the HRV detection, compared with the HW litters, the LW litters exhibited a lower mean HR (p<0.05). In the isolation test, a highly significant higher ACT value was observed between the HW litters, compared to the LW litters (p<0.01). Significant differences were observed in standard deviation of R-R intervals, standard deviation of all normal to normal intervals, and most frequency-domain indicators: very low-frequency, low-frequency, and high frequency between the HW and LW litters as well. The difference in LF:HF was not significant (p = 0.779). Conclusion: This study suggests that compared with litters of low 20-day litter weights, litters with higher 20-day litter weight take more positive strategies to cope with stress and have stronger HRV regulation capacity; HW litters demonstrate better anti-stress and adaptation capacity in the case of regrouping and isolation.
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Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps
Siru Ren,Menglong Sun,Zebin Jin,Yukun Guo,Huiqin Ling,Anmin Hu,Ming Li 대한금속·재료학회 2019 ELECTRONIC MATERIALS LETTERS Vol.15 No.5
A new kind of intermetallic compounds (IMC) were found around copper pillar in micron level bumps. To investigate theformation mechanism, three different sized Sn/Ni/Cu bumps (10 μm, 20 μm, 50 μm) were electroplated then reflowed at230 °C for 100 s. After reflow process, a thin layer of IMC was formed around copper pillar, which is attributed to surfacewetting behavior. After aging at 170 °C and 200 °C for different times, the growth mechanism of sidewall IMC was observedby scanning electron microscopy combined with electron backscatter diffraction (EBSD) technology. Surface diffusion wasconsidered to be the main driving force for sidewall IMC growth for the activation energy of them was found to be muchsmaller than that in previous studies. The EBSD results showed a preferred orientation of sidewall Cu3Sngrains <100> beingperpendicular to copper periphery, which indicated direction of Cu atoms flux during Cu3Sngrowth. Formation mechanismof this novel sidewall IMC was proposed based on surface wetting and surface diffusion. The findings contribute to the failuremechanism study in small size bumps and provide insights into the reliability of 3D electronic packaging.
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