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정일호,서상원,장봉기,Jung, Il Ho,Seo, Sang Won,Jang, Bong Ki 한국품질경영학회 2017 품질경영학회지 Vol.45 No.3
Purpose: The purpose of this study is to analyze quality control strengthening pilot project in development stages of weapon systems which ensures zero-defect. In order to achieve that, we propose collaboration support system between related organizations. Methods: First, we analyze how quality control methods has been developed from reviewing the preliminary study in commercial and defense industry. Then, we suggest improvement plans for quality control in defense industry and propose a pilot study which able to improve the recognized problems. Results: The results of this study ensures the participants in defense industry recognize the importance of quality control and form a consensus by sharing a case study. Finally, we propose the standardized work process by utilizing manual and manpower dispatching. Conclusion: As a result, this study clarifies the scope and role of relevant organizations to achieve the defense quality assurance in the total life cycle(TLC). Also, this paper guides the collaboration system between the relevant organization which differs from the commercial industry currently divided into development-production-quality.
3차원 패키징용 TSV의 열응력에 대한 열적 전기적 특성
정일호,기세호,정재필,Jeong, Il Ho,Kee, Se Ho,Jung, Jae Pil 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.2
Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.
다물체 동역학을 이용한 DC 모터 소음 저감에 관한 연구
정일호(Il-Ho Jung),박태원(Tae-Won Park),박지연(Ji-Yeon Park) 대한기계학회 2004 대한기계학회 춘추학술대회 Vol.2004 No.4
The DC Motor of a vehicle may cause noise and vibration due to high-speed revolution, which can make a driver feel uncomfortable. There have been various studies that attempted to solve these problems, mostly focusing on the causes of noise and vibration and the means of preventing them. The CAE methodology is more efficient than a real test for the purpose of looking for various design parameters to reduce the noise and vibration of the DC motor. In this study, a design process for reducing brush noise is presented with the use of a computer model, which is made by using a multi-body dynamics program (DADS). The design parameters to reduce the brush noise and vibration were proposed using a computer model. They were used to reduce the noise and vibration of a DC motor and verified by the test results of a fan DC motor in a vehicle. This method may be applicable to various DC motors.
정일호(Il Ho Jung),박태원(Tae Won Park),한상원(Sang Won Han),서종휘(Jong Hwi Seo),김성훈(Sung Hoon Kim) Korean Society for Precision Engineering 2004 한국정밀공학회지 Vol.21 No.8
The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.
좌표계 연성에 의한 동력전달계 포함 차량 운동 시뮬레이션 연구
정일호(Il Ho Jung),양홍익(Hong Ik Yang),윤지원(Ji Won Yoon),박태원(Tae Won Park),한형석(Hyung Suk Han) Korean Society for Precision Engineering 2005 한국정밀공학회지 Vol.22 No.5
Recently, the importance of CAE research is growing with the advances of the automotive and computer industry. In addition, multi-body dynamics and powertrain analysis are the most important factors in improving the vehicle design. Since engine torque with curve-data was used for analyzing full car simulation in the multi-body dynamics system for many years, it is impossible to assess the concurrent analysis of the engine and powertrain element included in a real full car system. In powertrain, since vehicle are usually modeled as a simple mass and a inertia, they can not be seen as real cars. Moreover, it is hard to obtain additional dynamics data other than the longitudinal velocity value in movement. Because of the reason that was previously discussed, it is necessary to consolidate the two parts as one routine program for design and development through the coordinate system connectivity, and presented here is a program named O-DYN. Using an object-oriented language C++ , this program has a good structure with the valuable characteristics of objectivity, inheritance, and reusability. The reliability of this multi-body dynamics program is examined by DADS, which is the general dynamics program, using DAE solver and PECE integral function with the common coordinator separation method. As a result, we can obtain a better solution and total dynamics data in either area through this process. This program will be useful for analyzing full car simulation with powertrain.
정일호(Il Ho Jung),김창수(Chang Su Kim),서종휘(Jong Hwi Seo),박태원(Tae Won Park),김희진(Hee Jin Kim),최재락(Jae Rak Choi),변경석(Kyng Seok Byun) Korean Society for Precision Engineering 2005 한국정밀공학회지 Vol.22 No.4
This paper presents the development of the design of the robot element. Robot element design is an important part of robot design since it decides the performance and life time of the robot. It is necessary that the robot kinematics and the robot dynamics are accomplished to design the robot elements. The robot kinematics and dynamics determine the design parameters of the element. We developed a robot element design program with which a designer can design the robot element with convenience and reliability. The program is composed of motor, harmonic driver and ball-screw design. The program is founded on the virtual robot design program. The virtual robot design program is the powerful software which may be used to solve various problems of the robot kinematics and dynamics. The robot element design program may be used to calculate the design parameters of the element that are necessary to design robot element. Therefore, the designer can decide upon the available robot elements available to perform the objective of the robot. The robot element design program is expected to increase the competitiveness and efficiency of the robot industry.
기세호,신지오,정일호,김원중,정재필,Kee, Se-Ho,Shin, Ji-Oh,Jung, Il-Ho,Kim, Won-Joong,Jung, Jae-Pil 대한용접접합학회 2014 대한용접·접합학회지 Vol.32 No.3
TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.