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양일영(Il-Young Yang),변재현(Jai-Hyun Byun) 대한산업공학회 2022 대한산업공학회지 Vol.48 No.5
A case study is presented applying the signal-response robust design approach to optimize temperature measurement system of a test chamber. Control factors are identified by cause and effect diagram and noises are reflected by a compound noise factor to reduce the size of the experiment.2<SUB>Ⅲ</SUB><SUP>5-2</SUP> fractional factorial design is employed with two replications and three signal factor levels. Experimental data are analyzed by the response function modeling, and optimal conditions for the control factors are determined.
양일영(Il Young Yang),강준구(Jun Gu Kang),유상우(Sang Woo Yu),오근태(Geun Tae Oh),나윤균(Yoon Gyoon Na) 한국신뢰성학회 2016 신뢰성응용연구 Vol.16 No.3
Purpose: The purpose of this study was to develop the accelerated life test method for Constant Electrical Potential Electrolysis gas sensor (CEPE gas sensor). Methods: The parts and modules of CEPE gas sensor were analyzed by using Reliability Block Diagram (RBD). Failure Mode and Effect Analysis (FMEA) and Quality Function Deployment (QFD) methods were performed for each part to determine the most affecting stress factor in its life cycle. The long term testing was conducted at three different dry heat levels and the acceleration factor was developed by using Arrhenius relationship. Conclusion: The acceleration factor for CEPE gas sensor was developed by using FMEA, QFD, and statistical analysis for its failure data. Also qualification tests were designed to meet the target life.
의약품 유통 관리용으로 사용되는 UHF 대역 RFID Tag의 가속수명시험법 개발
양일영(Il Young Yang),유상우(Sang Woo Yu),박정원(Jung Won Park),조원서(Won-Seo Joe) 한국신뢰성학회 2014 신뢰성응용연구 Vol.14 No.2
RFID (Radio Frequency IDentification) system is recognition technology which can maintain various object’s information. Reliability of RFID tags is the most important factor in RFID system. In this paper, we proposed ALT (Accelerated Life Test) method for UHF RFID tags. Temperature and humidity were adopted as stress factors and the accelerated life tests were conducted in three different conditions. We performed failure analysis for identifying failure mechanism and statistical analysis of test data. In the statistical analysis, we employed Inverse Power law for relationship between tag’s life and stress. Through the statistical analysis, we proposed acceleration factor for several levels of temperature-humidity. The reliability qualification test plans were also designed for the tag’s target reliability.
파렛트 유통관리용 RFID 태그의 신뢰성 평가기준 개발
조완수(Wan-Su Jo),양일영(Il-Young Yang),유상우(Sang-Woo Yu),유환희(Hwan-Hee Yoo) 대한전자공학회 2016 대한전자공학회 학술대회 Vol.2016 No.6
RFID(Radio Frequency Identification) tags are used in purpose of pallet supply management. As demand company requires a life expectancy of pallets, it is essential to secure reliability. Tags take lots of influence on characteristic surrounding environmental conditions. This study developed environment test plan and life test plan by analysing field research and standard.
정나현(Na-Hyeon Jung),김지영(Ji-Young Kim),박지희(Ji-Hee Park),양일영(Il-Young, Yang) 한국신뢰성학회 2020 한국신뢰성학회 학술대회논문집 Vol.2020 No.7
Purpose : In a general case, the life test could designed based on the failure mode and mechanism of components and materials or field failure cases. However, it is difficult to predict which components or parts could cause failure of an assembly in case of a new developed product or assembly that combined many different components and materials. Therefore, in this paper we studied the life test for the new developed assembly A that combined many electronic components. Methods : It is important for the life test design to choose an effective stress of the assembly A. The effective stress factor selecting is most important especially when we could not know the failure mode and mechanism. In this paper, the effects of every possible stresses were analysed using QFD(Quality Function Deployment) method. Temperature difference between ground and high altitude was found as the effective stress of the assembly A. To accelerate temperature difference we designed the life test that accelerated the life cycle. Result : The life test was designed for the new developed assembly A and the failure were found in every samples at the similar test step. Samples were three. The fault was not occurred the specific component but the connect part that connect between two circuit cards. We predicted the MCBF(Mean Cycle Between Failure) of the assembly A using every samples’ failure cycles based on a statistical analysis. Conclusion : In this paper the life test design was analysed and done for the assembly A which combined many electronic components. It is difficult to generalized the life test method for new developed assemblies. Therefore, from the beginning of various life test analyses are necessary to distinguish factors that affect the lifetime.