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타액오염이 트레이 레진 및 변연 형성재와 Polysulfide 인상재의 접착력에 미치는 영향
김용학,양홍서,Kim, Yong-Hak,Yang, Hong-Seo 대한치과보철학회 2000 대한치과보철학회지 Vol.38 No.5
This study was investigated to compare the bond strength of polysulfide adhesive between tray resin and border molding materials and to evaluate the effect of saliva contamination on them. We made the 135 resin tray secimens with a dimension of $1{\times}1{\times}1cm$ and divided them into 3 groups by the materials 1) Quicky group, 2) Compound group, and 3) Impregum group Each group was subdivided by saliva contimination. Group S1 : applied adhesive without saliva contamination Group S2 : applied adhesive after drying 15seconds after saliva contamination Group S3 : applied adhesive no after saliva contamination. Tensile tests were performed with a Universal Load testing machine. Results showed Impregum group significantly higher bond strength than Quicky group, but there was no significant difference in adhesive bond strength between Compound group and Quicky group in experimental group by materials In experimental group by saliva contamination, S1 group is significantly higher bond strength than S2 group and S2 group is significantly higher bond strength than S3 group in Quicky group and S1, S2 group is significantly higher bond strength than S3 group in Compound group and Impregum group. Impression compound and Impregum F which are usually used as an individual tray border mold-ing material can be said to be satisfied in adhesive bond strength to polysulfide impression materials. After try-in and clinical adjustment are performed, a custom tray should be properly rinsed and air dried before tray adhesive was placed.
IEC 61850 기반 154[㎸] 변전자동화 시스템의 실계통 구축
김용학(Yong-Hak Kim),한정열(Jeong-Yeol Han),이남호(Nam-Ho Lee),김병헌(Byeong-Heon Kim),박내호(Nae-Ho Park),홍정우(Jung-Woo Hong) 한국조명·전기설비학회 2010 조명·전기설비학회논문지 Vol.24 No.5
본 논문에서는 IEC 61850 기반의 지능형전자장치(IED)를 구비한 변전자동화 시스템(SAS)의 가용성 및 신뢰성을 실계통에서 향상시키기 위한 가이드라인을 제시한다. IEC 61850 표준의 통신 네트워크 및 시스템은 전력사가 변전소를 신/증설하는 경우에 새로운 설계 개념을 도입하도록 하고 있다. 그러나 현재는 기존의 2차계통인 보호, 감시, 제어 및 고장기록장치와 1차계통의 설비간에 배선에 의한 인터페이스에 기반을 두고 있으므로, 다기능의 IEDs가 기존과 유사한 방법으로 인터페이스를 하게 된다. 최근에는 전 세계적으로 많은 변전자동화 시스템의 구축사업이 보고되고 있으며, 또한 IEC 61850은 가장 보편적인 변전자동화 시스템을 위한 통신 표준이 되고 있다. This paper presents the guideline for enhancing the reliability and availability of SAS with IEC 61850 based IEDs in real power system. The IEC 61850 standard communication networks and systems allow utilities to consider new designs for substations applicable both new substation and refurbishments. The existing solutions are based on hardwired interface between the primary substation equipment and the secondary protection, monitoring, control and recording devices. All over the world, lots of projects at different stages of realization have been reported during the last year leading to a rapid maturation of the associated technologies. At present, IEC 61850 is becoming a popular communication standard for the substation automation system.