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구홍모 ( Hong Mo Koo ),구인모 ( In Mo Ku ),고영채 ( Young Chae Ko ),이희 ( Hei Lee ),양기원 ( Gi Won Yang ),이영일 ( Young Il Lee ),조태일 ( Tae Il Cho ),강유미 ( You Mee Kang ) 대한산부인과학회 2004 Obstetrics & Gynecology Science Vol.47 No.9
To our knowledge, implantation into the uterine muscle wall is one of the rare form of ectopic pregnancy, with only 16 cases reported until 1995. The early diagnosis depends upon the sonographic finding of intramural gestational sac-like growth and persis
최근 10년간 (1994-2003) 서울성애병원에서 출생한 신생아 출생성비에 관한 통계보고
구인모 ( In Mo Ku ),고영채 ( Young Chae Ko ),이희 ( Hee Lee ),최원일 ( Won Il Choi ),양기원 ( Ki Won Yang ),구홍모 ( Hong Mo Koo ),김정욱 ( Jeong Wook Kim ) 대한산부인과학회 2004 Obstetrics & Gynecology Science Vol.47 No.10
목적 : 서울 성애병원에서의 최근 10년간의 출생 성비를 조사하고 향후 문제점을 재조명하고자 한다. 연구 방법 : 1994년부터 2003년까지 10년간 본 의료원에서 분만된 신생아를 대상으로 조사하였다. 첫번째 아이와 두번째 아이의 출생성비를 조사하였고 세번째 아기의 경우 3 group (첫째와 둘째가 여자인 경우, 첫째와 둘째가 남자인 경우, 첫째와 둘째가 남자와 여자가 공존하는 경우)으로 세분화해서 조사하였다. 자료는 분만대상과 환자의 의무 기록지에 Objective : This study was aimed to investigate of newborn babies sex ratio in Seoul Seong Ae hospital and review of future problem. Methods : We reviewed retrospectively the 21,332 cases of deliveries in women visiting at Seoul Seong Ae hospital from Jan
자궁경부의 전암성 병변과 침윤성 편평상피암에서 c-erbB-2 종양단백과 Topoisomerase 2-α의 발현
신승호 ( Seung Ho Shin ),구홍모 ( Hong Mo Koo ),김진석 ( Jin Seak Kim ),문혜경 ( Hye Kyoung Mun ),이재덕 ( Jae Deok Lee ),김상용 ( Sang Yong Kim ),한재희 ( Jae Hee Han ),조태일 ( Tae Il Cho ),이태진 ( Tae Jin Lee ) 대한산부인과학회 2002 Obstetrics & Gynecology Science Vol.45 No.12
목적 : 자궁경부의 전암성 병변과 침윤성 편평상피암에서 c-erbB-2 종양유전자와 새로운 증식표지자로 알려진 topoisomerase Ⅱ-α의 발현 정도와 연관성을 알아보고자 본 연구를 시행하였다. 연구 방법 : 생검이나 원추조직절제술을 통하여 얻어진 low-grade squamous intraepithelial lesion 22예와 high-grade squamous intraepithelial lesion 42예 및 자궁적출술을 통하여 침윤성 편평 Objective : The relationship was studied between expression of c-erbB-2 oncoprotein and topoisomerase 2-α as proliferating marker in precancerous lesions and invasive squamous carcinomas of the uterine cervix. Methods : Total 81 formalin-fixed, paraffin-e
강제대류에서 Vapor chamber heat sink의 열적 성능
김윤호(Yoon-Ho Kim),배수호(Soo-Ho Bae),차호진(Ho-jin Cha),구홍모(Hong-Mo Koo) 대한기계학회 2012 대한기계학회 춘추학술대회 Vol.2012 No.11
This paper presents thermal performance of vapor chamber heat sink under forced convection condition. Since the electronic industry has accelerated compact size, light-weight and highly integrated trend of electronic systems, thermal issues have been one of the most critical problems. A vapor chamber heat sink is one of the most efficient systems to improve the heat transfer performance without the increase of heat sink volume and fan flowrate. In order to evaluate thermal performance of vapor chamber heat sink, actual network device having CPU of high heat dissipation is chosen and temperature according to fan speed is measured. As a result, surface temperature of vapor chamber heat sink and CPU junction temperature shows good heat transfer performance with thermal resistance of less than 0.1℃/W. The thermal conductivity of vapor chamber is calculated about 5,000 W/mㆍK by using a CFD simulation.
전자부품 냉각을 위한 Vapor chamber heat sink의 열성능 연구
김윤호(Yoon-Ho Kim),전현수(Hyeon-Soo Jeon),배수호(Soo-Ho Bae),차호진(Hojin Cha),구홍모(Hong-Mo Koo) 대한기계학회 2013 대한기계학회 춘추학술대회 Vol.2013 No.12
As the electronic devices is more accelerated the compact size, the light-weight and the high integrated trend of electronic components, the most increasingly the heat generation problem rises. Recently, there are growing interests in developing alternative heat sink devices. Vapor chamber heat sinks are heat-spreading systems that develop phase change to spread heat and are of increasing interest in the electronics industry. Vapor chambers are increasingly being investigated as a way to spread the heat generated by an electronic component to the base of a heat sink for typical heat sink applications. In this study, vapor chamber heat sinks have been performed to investigate the thermal performances under the natural convection and forced convection conditions and to compare their performance against copper base heat sink. It is fabricated to be used a real telecommunication equipment specifications. The thermal characteristics of vapor chamber heat sinks are studied according to various input power using dummy heater, test jig and fan. The study shows that vapor chamber heat sinks can thermally perform better than a copper block heat sink. The thermal conductivity of the vapor chamber is also numerically analyzed using CFD simulation and is compared to the experiment results. Thus vapor chamber heat sinks provide good performance alternative to typical heat sinks.