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- 저자 : Si Hongyan (검색결과 3 건)
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Decision diagram based methods and reliability analysis for k-out-of-n: G systems
Shumin Li,Shudong Sun,Shubin Si,Shuai Zhang,Hongyan Dui 대한기계학회 2014 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.28 No.10
Binary k-out-of-n systems are commonly used reliability models in engineering practice. Many authors have extended the concept ofk-out-of-n system to multi-state k-out-of-n systems. This paper proposes a binary decision diagram (BDD) based approach for binary kout-of-n: G system and a multi-state multi-valued decision diagram (MMDD) based approach for multi-state k-out-of-n: G system. BDDand MMDD have been extensively used for representing and manipulating logic functions in many areas, including reliability modelingand analysis. In this paper, patterns of BDD/MMDD for binary/multi-state k-out-of-n: G system are summarized and proved, a two-stepalgorithmic process is proposed for modeling the BDD/MMDD and three case studies are implemented to demonstrate the presentedmethods. Complexity analysis shows that the presented method is more computationally efficient than the traditional algorithms for kout-of- n: G system.
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A Self-adaptive Time Slot Allocation Algorithm Based Low Value of SINR in TD-LTE System
Yao Zhongmin,Lu Yanyang,Liu Wei,Si Hongyan 보안공학연구지원센터 2015 International Journal of Future Generation Communi Vol.8 No.6
In time division duplex Long Term Evolution (TD-LTE) system, the protocol provides 7 different time slot configurations. Only one fixed time slot deployed in mobile network. This paper proposed a dynamic time slot allocation algorithm, the system according to the user equipment (UE) detected the environmental signal to interference and noise ratio (SINR) to dynamically decide the time slot configuration, especially the UE in the situation of relatively bad wireless environment and the lower SINR value, can adopt the polling algorithm, obtained the dynamic time slot configuration. This method is simple in calculation, can reduce redundant computational burden in the system. The result of simulation demonstrated that the algorithm has significant effect in improving the networking throughput、 increasing the system spectrum utilization rate.
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Yi Wang,Kai Wang,Jiajun Hu,Kang Si,Hongyan Xia 대한금속·재료학회 2023 ELECTRONIC MATERIALS LETTERS Vol.19 No.6
Thermal interface materials with high thermal conductivity are the best choice to solve the current overheating problem of electronic devices, and the choice of thermal conductive fi ller is a key factor aff ecting the performance of thermal interface composites. Hexagonal boron nitride sheet is considered to be ideal thermal conductive fi ller, but the thermal conductive eff ect of single fi ller is still insuffi cient to meet actual needs. Here, a new type of hybrid fi ller mixed with boron nitride sheet and boron phosphide particles is used to prepare epoxy based composites. When the fi ller volume fraction is 40%, the thermal conductivity of composites reaches 3.18 W m −1 K −1 . Under the same content, the thermal conductivity of the composites with mixed fi llers outperforms those with boron nitride sheet alone. At the same time, the composite material shows high breakdown strength of 46 kV mm −1 . This work provides a new way to prepare thermal interface materials with high thermal conductivity for modern electronic packaging.
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