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Control of Cascaded H-Bridges STATCOM based on the Power Flow Management
Ping-Heng Wu,Chia-Tse Lee,Hsin-Chin Chen,Po-Tai Cheng 전력전자학회 2015 ICPE(ISPE)논문집 Vol.2015 No.6
As smart grid techniques are getting more positive perspective and expected to grow in the future, the STATic synchronous COMpensator (STATCOM) has become one of the most important roles to manage the power flow and regulate the grid voltage. The Modular Multilevel Cascaded Converter (MMCC) based on single star bridge cell (SSBC) is very suitable for STATCOM application at the medium-voltage level in the power system. The dc capacitors voltage balancing control is a critical issue to secure the stable operation of MMCCSSBC converter. Four different control methods based on power flow analysis have been considered. The performance of each controller is evaluated under steady state or even Low Voltage Ride Through (LVRT) operation. Each controller has its power flow management and its feature. Experimental test results are given to verify these control methods can well regulated the dc bus voltages under the unbalanced grid voltages.
A Fully Distributed Architecture for the Hybrid Cascaded Converter based Utility Interface
Yu-chen Su,Ping-heng Wu,Po-tai Cheng 전력전자학회 2019 ICPE(ISPE)논문집 Vol.2019 No.5
This paper attempts to develop a utility interface for hybrid renewable energy resources, which is based on the hybrid cascaded converter so that several solar panels and one wind turbine can be integrated together. Different from conventional centralized architecture, this paper decentralizes not only the controller but also the modulator to enhance the modularity and the scalability of the overall system, becoming a fully distributed architecture. Further investigation shows that the power variation between the solar panels and the wind turbine has almost no influence on the power quality. Laboratory test results are provided to verify the feasibility of the discussed system.
Yi-Hsuan Chen,Yi-Hsiang Lai,Ping-Heng Wu,Li-Syuan Chen,Yung-Sen Lin,Chih-Ming Chen 한국공업화학회 2020 Journal of Industrial and Engineering Chemistry Vol.83 No.-
Surface metallization of polymer substrate andfilm adhesion are crucial to the development offlexibleelectronics. This study demonstrates the co-silanization engineering on the polyimide (PI)film by mutualintercropping of two organosilane molecules to improve their grafting orientability and enhance theadsorbability toward the PI substrate and loaded metal atoms. The mutual intercropping-inspired cosilanizationengineering is implemented by using 3-[(trimethylsilyl)ethynyl]pyridine (TEP) as asupporting organosilane to spatially confine the grafting orientation of the supported aminosilane, 3-[2-(2-aminoethylamino)ethylamino]propyl-trimethoxysilane (ETAS), leading to the formation of a wellorientedorganosilane composite nanolayer as adhesion promotion layer forflexible conductors. Theflexible Cu conductor electrolessly deposited on the PIfilm by co-silanization shows improved adhesionstrength (0.9 kgf/cm) compared to those based on mono-silanization (0.51 kgf/cm) and sputtered Ta/Cu(0.4 kgf/cm). Superior deformability (bendability) was also achieved for the co-silanized Cu/PI sample byretaining good electrical property after bending cycle up to 1000.