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        Evolution in Microstructures and Mechanical Properties of Pure Copper Subjected to Severe Plastic Deformation

        Mingya Zhang,Li Liu,Shan Liang,Jinghui Li 대한금속·재료학회 2020 METALS AND MATERIALS International Vol.26 No.10

        Considering the great advantage of improving the pressing speed in reducing the number of repeated deformation passes andgrain size, high-speed equal channel angular pressing (ECAP) technology has been applied to achieve the perfect distributionof grain size in a sample volume of pure copper. The microstructures and mechanical properties of pure copper sufferingECAP are investigated. The results show that the well refined grains are obtained through three stages, during which the grainreorientation and recrystallization occurs. After ECAP, the volume fraction of high-angle grain boundaries is reduced, butshows an obvious increase in the population for high-pass extruded sample. Besides, ECAP can significantly increase theproportion of the special boundaries probably through the transformation from annealing twins to deformation twins. Thetensile strength of ECAP-ed sample greatly increased to 1.87 times larger than that of the annealed bar, and then improvedslowly regardless of increasing strain. The relationship between strength and grain size still obeyed Hall–Petch formula. The cloud maps of microhardness distribution illustrated that the hardness is severely improved after the first three passes,but leveled off after that. Besides, the cloud maps also present the moderate inhomogeneity of microhardness with highervalues in the edge and lower values towards the center.

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        Effect of annealing temperature on resistive switching behavior of Al/ La0.7Sr0.3MnO3 /LaNiO3 devices

        Li Juanfei,Wu Lei,Ma Mingyu,Song Ruifeng,Dong Chunhui,Wei Junfang,Li Jinsheng,Wang Xiaoqiang,Li Mingya 한국물리학회 2023 Current Applied Physics Vol.46 No.-

        La0.7Sr0.3MnO3 (LSMO)/LaNiO3 (LNO) thin films were deposited successively on Si single crystal by the sol-gel method. The bipolar resistive switching (RS) behavior was studied in Al/LSMO/LNO devices. Obvious current hysteresis was observed, the set (reset) voltage and resistance ratio were modulated by the annealing temperature of LSMO thin films. At the annealing temperature of 750 ◦C, good endurance and retention performance were obtained in the memory device. According to the fitting results of I–V curves, based on Schottky emission model, the conduction mechanisms of Al/LSMO/LNO devices were discussed. Our results may give a valuable insight on developing perovskite-type rare earth manganese oxide.

      • KCI등재

        Dynamic Recrystallization Behaviors and the Texture Evolution in Mg–9Al–1Zn Alloy Produced by ECAP at Different Temperatures

        Jintong Chen,Rui Sun,Guisheng Li,Ming Fang,Gaoshan Xu,Mingya Zhang,Jinghui Li 대한금속·재료학회 2022 METALS AND MATERIALS International Vol.28 No.11

        The influence of changes in temperature from 250 to 400 °C with 50 °C intervals during ECAP processing on the textureevolution and recrystallization behavior for Mg–9Al–1Zn alloy was studied. The results demonstrate that {10 1 2} extensiontwins and dislocation slip are the dominating deformation modes in low temperature (250 °C and 300 °C) ECAP processing,and those twins gradually disappear with increasing temperature. Most of the recrystallized grains are observed to exhibit(0001) poles 70°–90° away from the normal direction due to reorientation of the grains caused by twins and dislocationslips, with the texture changing from a strong basal texture to the texture component close to { 1 2 1 0} and {01 1 0}. Theproduction of ultrafine recrystallized grains in the specimens treated by ECAP at 400 °C was aided by grain fragmentationcaused by twins interaction, as well as dislocation slip and temperature increase during severe plastic deformation (SPD).

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