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U. Böyük,N. Maraşlı,E. Çadırlı,H. Kaya,K. Keşlioğlu 한국물리학회 2012 Current Applied Physics Vol.12 No.1
AleCueAg eutectic alloy was directionally solidified upwards with different growth rates (1.83e 498.25 mm/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99e8.79 K/mm) at a constant growth rate (8.30 mm/s) by using a Bridgman type directional solidification apparatus. The dependence of microhardness (HV) on the growth rate (V), temperature gradient (G) and microstructure parameter (l) were found to be HV ¼ k1 V0.10, HV ¼ k2 G0.13 and HV ¼ k3 l 0.22, respectively. The electrical resistivity of the AleCueAg eutectic cast alloy increases linearly with the temperature in the range of 300e780 K. The enthalpy of fusion and specific heat change during melting for same alloy were also determined to be 223.8 J/g, and 0.433 J/g K, respectively by a differential scanning calorimeter from heating curve during the transformation from eutectic solid to eutectic liquid.
Determination of Interfacial Energies for Solid Al Solution in Equilibrium with Al-Cu-Ag Liquid
K. Ke lio lu,Y. Ocak,S. Aksöz,N. Mara ll,E. Çadlrll,H. Kaya 대한금속·재료학회 2010 METALS AND MATERIALS International Vol.16 No.1
The equilibrated grain boundary groove shapes of a solid Al solution in equilibrium with Al-Cu-Ag liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient,solid-liquid interfacial energy, and grain boundary energy of the solid Al solution were determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase for Al-16.42 at.% Ag-4.97at.% Cu and Al-16.57 at.% Ag-11.87 at.% Cu alloys and the thermal conductivity ratio of the liquid phase to the solid phase for Al-16.57 at.% Ag-11.87 at.% Cu alloy at the melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.