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A comprehensive plan on reduction of insect foreign materials in food
JaHyun Na 한국응용곤충학회 2018 한국응용곤충학회 학술대회논문집 Vol.2018 No.04
식품 중 발견 이물은 광물성, 동물성, 식물성 이물로 대별된다. 식약처 이물 발생 신고 자료를 보면 곤충(35%), 곰팡이(10%), 금속(8%), 플라스틱(5%) 순으로 곤충이물이 거의 모든 식품유형에서 가장 높은 빈도로 발생하며 제조 중 발생(6.5%) 보다는 소비, 유통 단계 유입(39.4%), 판정불가(53.4%)가 대부분인 것으로 보고되고 있다. 곤충 이물의 경우 일반적으로 인체 위해성과는 큰 관계는 없으나 소비자에게 혐오감을 불러일으키며(특히 생존곤충 발견 시) 비위생적 취급의 우려로 인해 식품 안전에 대한 소비자 불안감을 가중시키고 언론과 소비자단체를 통해 지속적인 이슈가 되어 식품 기업의 매출감소, 위생, 안전성 측면의 신뢰도를 감소시키고 이물관련 공무원의 이물조사 업무가중 등 행정력낭비를 유발하고 있다. 따라서 산업현장에서 실용화될 수 있는 효과적인 이물 저감화 기술의 개발로 이물발생을 낮추고 국민의 식품안전에 대한 체감도를 높이는 것이 필요하다.
A comprehensive plan on reduction of insect foreign materials in food
JaHyun Na 한국응용곤충학회 2018 한국응용곤충학회 학술대회논문집 Vol.2018 No.10
식품 중 발견 이물은 광물성, 동물성, 식물성 이물로 대별된다. 식약처 이물 발생 신고 자료를 보면 곤충이물이 거의 모든 식품유형에서 가장 높은 빈도(40% 내외)를 차지한다. 식품 중 곤충 이물은 직접적인 인체 위해보다는 소비자에게 혐오감 유발, 식품업체 비위생적 취급 우려와 같이 간접적으로 식품 안전에 대한 소비자 불안감을 가중시키고 언론과 소비자단체를 통해 지속적인 이슈가 되어 식품 기업의 매출감소, 위생, 안전성 측면의 신뢰도를 감소시키고 민원처리, 이물조사 업무가중 등 행정력낭비를 유발하고 있다. 식품 중 발생하는 곤충이물은 다양한 원인으로 유발되어 확실하게 규명되는 제조 중발생(6.5%), 소비, 유통 단계 유입(39.4%) 이외에 대부분이 판정불가(53.4%)로 처리되고 있다. 따라서 앞으로 식품산업에서 는 생산단계와 유통, 보관 단계에 실용화될 수 있는 효과적인 곤충 이물 저감화기술을 개발/적용하여 이물발생 리스크를 관리하고 국민의 식품안전에 대한 체감도를 높이는 것이 필요하다.
Jiyeong Park,Hyuk Kwon,Jahyun Na,Yongshik Chun,Wook Kim,Yonggyun Kim 한국응용곤충학회 2014 한국응용곤충학회 학술대회논문집 Vol.2014 No.10
A novel oxidant fumigation (NOF) is a commercial bleaching and disinfection agent. Recent study indicates its insecticidal activity. However, its exact mode of action to kill insects is not known. This study sets up a hypothesis that reactive oxygen species released from NOF is a main factor to kill insects. Plodia interpunctella is a lepidopteran insect pest infesting various stored grains. Both larvae and adults were susceptive to NOF. To test the hypothesis, we needed to identify antioxidant genes in P. interpunctella. Superoxide dismutase (SOD) and thioredoxin-peroxidase (Trx) were identified from P. interpunctella EST library using ortholog sequences of Bombyx mori. Both SOD and Trx were expressed in larvae of P. interpunctella expecially against oxidative stress induced by bacterial challenge. The bacterial challenge also induced some heat shock protein (HSP) genes. Similarly, different doses of NOF significantly induced both SOD and Trx genes. There results suggest that NOF at sublethal doses releases reactive oxygen species, which may be detoxified by the antioxidant activities of SOD and Trx of P. interpunctella.
Sunil Kumar,Jeyeong Park,Eunseong Kim,Jahyun Na,Yong Shik Chun,Hyuk Kwon,Wook Kim,Yonggyun Kim 한국응용곤충학회 2014 한국응용곤충학회 학술대회논문집 Vol.2014 No.10
A novel oxidant fumigation (NOF) has been considered as alternative fumigant to replace methyl bromide that is a serious ozone depleter. Its high oxidative activity has been used as a bleaching or sanitary agent. Though some reports an insecticidal activity of NOF, its insecticidal action is yet to be understood. This study was conducted with an observation of an insecticidal activity of NOF against Plodia interpunctella, which is a stored grain insect pest. Cytotoxicity test was performed by using MTT assay, NOF gave a significant cytotoxicity on both Sf9 cells and HiFive insect cell lines. Sf9 cells were higher susceptible (IC50 = 43.2+ 3.5 ppm) to chloride dioxide than HiFive cells (IC50 = 174.6 + 5.9 ppm). To understand its cytotoxic effect on P. interpunctella, the larval hemocytes were incubated in vitro with different doses of NOF for 40 min at room temperature. In a dose-dependent manner, NOF gave a significant toxicity to the hemocytes. When NOF was injected to larvae of P. interpunctella, it significantly reduced total hemocyte counts compared to control. These results indicate that NOF has cytotoxic effect against hemocytes of P. interpunctella. This hemolytic activity of NOF can be regarded as a lethal factor to the stored grain insect pest.
Kim, Na Rae,Lee, Yung Jong,Lee, Changsoo,Koo, Jahyun,Lee, Hyuck Mo IOP 2016 Nanotechnology Vol.27 No.34
<P>By treating oleylamine (OA)-capped Ag–Cu nanoparticles with tetramethylammonium hydroxide (TMAH), we obtained metal nanoparticles that are suspended in polar solvents and sinterable at low temperatures. The simple process with ultra sonication enables synthesis of monodispersed and high purity nanoparticles in an organic base, where the resulting nanoparticles are dispersible in polar solvents such as ethanol and isopropyl alcohol. To investigate the surface characteristics, we conducted Fourier-transform infrared and zeta-potential analyses. After thermal sintering at 200 °C, which is approximately 150 °C lower than the thermal decomposition temperature of OA, an electrically conductive thin film was obtained. Electrical resistivity measurements of the TMAH-treated ink demonstrate that surface modified nanoparticles have a low resistivity of 13.7?×?10<SUP>−6</SUP> Ω cm. These results confirm the prospects of using low-temperature sinterable nanoparticles as the electrode layer for flexible printed electronics without damaging other stacked polymer layers.</P>
Koo, Jahyun,Kwon, Soonho,Kim, Na Rae,Shin, Kihyun,Lee, Hyuck Mo American Chemical Society 2016 The Journal of Physical Chemistry Part C Vol.120 No.6
<P>Copper nanowires (Cu NWs) are promising materials for transparent electrode applications. However, their growth mechanism during water-based synthesis remains unclear. The steric hindrance of a surfactant, which has been considered in previous studies, is insufficient to explain the suppression of Cu oxide formation during water-based synthesis. In this paper, we suggest that ethylenediamine (EDA, C2H4(NH2)(2)), which is commonly used as a structure-directing agent (SDA), may play an important role as an oxidation inhibitor in water-based synthesis of Cu NWs. High-resolution transmission electron microscopy (HR-TEM) analysis indicated that the Cu NWs grow from icosahedral seeds. Additionally, energy-dispersive X-ray spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS) suggested that EDA affects the oxidation state of the as-prepared Cu NW surface. Finally, density functional theory (DFT) calculations revealed that the adsorption of EDA effectively hinders the adsorption of oxidizing species and prevents the oxidation of the Cu seeds. This effect is attributed to a filling of the antibonding states and an increase in the electrostatic repulsion between the Cu seeds and the oxidizing species.</P>