http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
자동차 전장부품을 위한 Sn-0.5Cu-(X)Al(Si) 중온 솔더의 접합특성 연구
유동열,고용호,방정환,이창우,Yu, Dong-Yurl,Ko, Yong-Ho,Bang, Junghwan,Lee, Chang-Woo 대한용접접합학회 2015 대한용접·접합학회지 Vol.33 No.3
Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.
다중 리플로우에 따른 Sn-Cu-(X)Al-(Y)Si/Cu 접합부 특성 연구
유동열(Dong-Yurl Yu),손준혁(Jun-Hyuk Son),고용호(Yong-Ho Ko),이창우(Chang-Woo Lee),변동진(Dongjin Byun),방정환(Junghwan Bang) 대한용접·접합학회 2020 대한용접·접합학회지 Vol.38 No.2
Joint properties of Sn-Cu-(X)Al-(Y)Si lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-(0.01, 0.03)Al-0.005Si(wt.%) alloys were then fabricated in the form of solder balls for reflow samples. To evaluation of solder joint properties, solder ball was attached to PCB finished with OSP Cu pad. The reflow process was performed for 40 s above 260.5 ℃. And solder joint was evaluated by repeating the reflow process up to 10 times. The melting temperatures of Sn-0.7Cu, 0.01 Al-0.005Si and 0.03Al-0.0.005Si were 227.5, 230.2 and 231.4 ℃, respectively. Initial microstructures are composed of β-Sn regions surrounded by eutectic networks with spherical Cu6Sn5 IMC particles. However, with the increasing Al content, refined eutectic β-Sn + Cu-Sn IMC networks were observed. The shear strength of Sn-0.5Cu-0.03Al-0.005Si solder joints was higher than Sn-0.5Cu-0.01Al-0.005Si and Sn-0.7Cu solder after 10 reflow test.
Multiple reflows에 따른 Sn-Cu-xCr/Cu 접합계면의 금속간화합물 거동 및 기계적 특성 연구
유동열(Dong-Yurl Yu),손준혁(Junhyuk Son),고용호(Yong-Ho Ko),이창우(Chang-Woo Lee),방정환(Junghwan Bang) 대한용접·접합학회 2018 대한용접·접합학회지 Vol.36 No.2
In this study, a new lead-free solder, Sn-0.7Cu-0.2Cr (wt.%) alloy, was developed. The mother alloy of Sn-0.7Cu-0.2Cr solder, which has melting temperature of about 231℃, was fabricated and then made by 300 um solder balls. To evaluate the thermo-mechanical reliability of the new solder alloy for automobile electronics, multiple reflows test was performed. As a result of the microstructure analysis, grain size increased with increasing reflow test. And microstructure of Sn-3.0Ag-0.5Cu solder was finest. It was also confirmed that the microstructure of Sn-0.7Cu-0.2Cr solder was finer than Sn-0.7Cu solder by Cr addition. The IMC thickness results show that the presence of Cr in solder inhibits the growth of interfacial Cu6Sn5 layer and Cu3Sn layer. Specifically, the shear strength of the Sn-0.7Cu-0.2Cr/Cu solder joints increases by 9% and 22% than that of Sn-3.0Ag-0.5Cu and Sn-0.7Cu solder joints after 10 reflows test at 1m/s shear speed. And brittle fracture rate (%) of Sn-0.7Cu-0.2Cr was lower than Sn-3.0Ag-0.5Cu and Sn-0.7Cu solder after 10 reflows test at 1m/s shear speed.
자동차 전장모듈용 Sn-Cu-Cr(Ca) 중온 솔더의 접합특성 연구
방정환,유동열,고용호,김정한,이창우,Bang, Junghwan,Yu, Dong-Yurl,Ko, Yong-Ho,Kim, Jeonghan,Lee, Chang-Woo 대한용접접합학회 2013 대한용접·접합학회지 Vol.31 No.5
Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.