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權寧住,김진안 홍익대학교 산업기술연구소 2001 産業技術 Vol.11 No.-
In this paper, the thermal stress analysis of the PCB(printed Circuit Board) of a monitor is carried out for various array types of chips on the printed circuit board and two PCB structural models. The electronic chip on the printed circuit board usually emits heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the printed circuit board may cause the malfunction of the electronic equipment such as monitor, computer etc.. Hence, the PCB should be designed to withstand this thermal load. The thermal stress analysis for the durability of the PCB is done using the finite element analysis code, NISA.
權寧住 홍익대학교 산업기술연구소 1997 産業技術 Vol.7 No.-
In this study, we reviewed the classification of the super-high-speed ship whose speed is larger than 50 knots and analyzed its mechanical engineering technology characterstics. It is concluded through this study that the traditional(mono or twin) hull form ship which is operated by buoyant force, lift force or air pressure has the limit in speed and size respectively to become to become the super-high-speed passenger and container ship. On the other hand, this analysis shows that the hybird hull form ship can be the super-high-speed ship. In this type of super-high-speed ship, there are SWASH ship, HYSWAS, LAHHS, HYACS, and SWAACS etc..