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Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying
Song Shu-Xiang,Zhou Zhang-Jian,Du Juan,Zhong Zhi-Hong,Ge Chang-Chun 한국분말야금학회 2006 한국분말야금학회 학술대회논문집 Vol.2006 No.1
Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers.
Research on Powder Metallurgy Technology in Fusion Materials in China
Ge Chang-Chun,Zhou Zhang-Jian,Du Juan,Song Shu-Xiang 한국분말야금학회 2006 한국분말야금학회 학술대회논문집 Vol.2006 No.1
In the viewpoint of engineering, materials problem is a key problem, which determines whether the exploitation of fusion energy will be success. The most important class of fusion materials is plasma-facing materials (PFM). W, as high Z high melting-point metal is one of the most important candidate materials due to its high plasma erosion resistance. Improving the ductility of W and W based alloy, lowering its ductile-brittleness transition temperature for meeting the requirements of fusion application is an important task. In this paper, severalpowder meatllurgy methods of fabricating W and W based materials are being investigated.
Yu-Hsiu Juan,Wei-Chou Chang,Chih-Yung Yu,Hsian-He Hsu,Guo-Shu Huang,De-Chuan Chan,Chang-Hsien Liu,Ho-Jui Tung 연세대학교의과대학 2011 Yonsei medical journal Vol.52 No.4
Purpose: To assess the clinical manifestations and multidetector-row computed tomography (MDCT) findings of afferent loop syndrome (ALS) and to determine the role of MDCT on treatment decisions. Materials and Methods: From January 2004 to December 2008, 1,100 patients had undergone gastroenterostomy reconstruction in our institution. Of these, 22 (2%) patients were diagnosed as ALS after surgery that included Roux-en-Y gastroenterotomy (n=9), Billroth-II gastrojejunostomy (n=7), and Whipple’s operation (n=6). Clinical manifestations and MDCT features of these patients were recorded and statistically analyzed. The presumed etiologies of obstruction shown on the MDCT were correlated with clinical information and confirmed by surgery or endoscopic biopsy. Results: The most common clinical symptom was acute abdominal pain, presenting in 18 patients (82%). We found that a fluid-filled C-shaped afferent loop in combination with valvulae conniventes projecting into the lumen was the most common MDCT features of ALS. Malignant causes of ALS, such as local recurrence and carcinomatosis, are the most common etiologies of obstruction. These etiologies and associated complications can be predicted 100% by MDCT. Conclusion: Our results suggest that MDCT is a reliable modality for assessing the etiologies of ALS and guiding treatment decisions.
Fabrication of Pure Refractory Metals by Resistance Sintering under Ultra High Pressure
Zhou Zhang-Jian,Du Juan,Song Shu-Xiang,Ge Chang-Chun 한국분말야금학회 2006 한국분말야금학회 학술대회논문집 Vol.2006 No.1
Refractory materials, such as W and Mo, are very useful elements for use in high-temperature applications. But it is not easy to fabricat pure W and Mo with very high density and retaining very fine grain size because of their high melting point. In this paper, a newly developed method named as resistance sintering under ultra high pressure was use to fabricate pure fine-grained W and Mo. The microstructure was analysis by SEM. The sintering mechanism is primary analyzed. Basic physical property of these sintered pure W and Mo, such as hardness, bend strength, are tested.
An I-V Circuit with Combined Compensation for Infrared Receiver Chip
Lei Tian,Qin-qin Li,Shu-juan Chang 대한전기학회 2018 Journal of Electrical Engineering & Technology Vol.13 No.2
This paper proposes a novel combined compensation structure in the infrared receiver chip. For the infrared communication chip, the current-voltage (I-V) convert circuit is crucial and important. The circuit is composed by the transimpedance amplifier (TIA) and the combined compensation structures. The TIA converts the incited photons into photocurrent. In order to amplify the photocurrent and avoid the saturation, the TIA uses the combined compensation circuit. This novel compensation structure has the low frequency compensation and high frequency compensation circuit. The low frequency compensation circuit rejects the low frequency photocurrent in the ambient light preventing the saturation. The high frequency compensation circuit raises the high frequency input impedance preserving the sensitivity to the signal of interest. This circuit was implemented in a 0.6μm BiCMOS process. Simulation of the proposed circuit is carried out in the Cadence software, with the 3V power supply, it achieves a low frequency photocurrent rejection and the gain keeps 109dB ranging from 10nA to 300μA. The test result fits the simulation and all the results exploit the validity of the circuit.
Wu, Xiao-Yuan,Lu, Can-Zhong,Xia, Chang-Kun,Chen, Shu-Mei,Liu, Jiu-Hui,Chen, Li-Juan,Yang, Wen-Bin Korean Chemical Society 2006 Bulletin of the Korean Chemical Society Vol.27 No.8
Four isostructural amino-acid-based polyoxomolybdates, {$M(H_2O)_3(pro)Mo_4O_{13}$}$_2{\cdot}2H_2O$ (pro = proline, M = Co (1), Ni (2), Cu (3), Zn (4)), have been synthesized and structurally characterized by single crystal X-ray diffraction, elemental analysis, IR spectrum, TG analysis. The structures of 1-4 are layered networks built up from {$Mo_8O_{26}(pro)_2$}$^{4-}$ units and {$M(H_2O)_3O_3$} octahedra, the uncoordinated water molecules occupying the interlayer regions.
An I-V Circuit with Combined Compensation for Infrared Receiver Chip
Tian, Lei,Li, Qin-qin,Chang, Shu-juan The Korean Institute of Electrical Engineers 2018 Journal of Electrical Engineering & Technology Vol.13 No.2
This paper proposes a novel combined compensation structure in the infrared receiver chip. For the infrared communication chip, the current-voltage (I-V) convert circuit is crucial and important. The circuit is composed by the transimpedance amplifier (TIA) and the combined compensation structures. The TIA converts the incited photons into photocurrent. In order to amplify the photocurrent and avoid the saturation, the TIA uses the combined compensation circuit. This novel compensation structure has the low frequency compensation and high frequency compensation circuit. The low frequency compensation circuit rejects the low frequency photocurrent in the ambient light preventing the saturation. The high frequency compensation circuit raises the high frequency input impedance preserving the sensitivity to the signal of interest. This circuit was implemented in a $0.6{\mu}m$ BiCMOS process. Simulation of the proposed circuit is carried out in the Cadence software, with the 3V power supply, it achieves a low frequency photocurrent rejection and the gain keeps 109dB ranging from 10nA to $300{\mu}A$. The test result fits the simulation and all the results exploit the validity of the circuit.