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3차원 LIGA 미세구조물 제작을 위한 마이크로 액추에이터 내장형 X-선 마스크
이광철,이승섭,Lee, Kwang-Cheol,Lee, Seung-S. 대한기계학회 2002 大韓機械學會論文集A Vol.26 No.10
We present a novel method for 3D microfabrication with LIGA process that utilizes a deep X-ray mask in which a micro-actuator is integrated. The integrated micro-actuator oscillates the X-ray absorber, which is formed on the shuttle mass of the micro-actuator, during X-ray exposures to modify the absorbed dose profile in X-ray resist, typically PMMA. 3D PMMA microstructures according to the modulated dose contour are revealed after GG development. An X-ray mask with integrated comb drive actuator is fabricated using deep reactive ion etching, absorber electroplating, and bulk micromachining with silicon-on-insulator (SOI) wafer. 1mm $\times$ 1 mm, 20 $\mu$m thick silicon shuttle mass as a mask blank is supported by four 1 mm long suspension beams and is driven by the comb electrodes. A 10 $\mu$m thick, 50 $\mu$m line and spaced gold absorber pattern is electroplated on the shuttle mass before the release step. The fundamental frequency and amplitude are around 3.6 kHz and 20 $\mu$m, respectively, for a do bias of 100 V and an ac bias of 20 $V_{p-p}$ (peak-peak). Fabricated PMMA microstructure shows 15.4 $\mu$m deep, S-shaped cross section in the case of 1.6 kJ $cm^{-3}$ surface dose and GG development at 35$^{\circ}C$ for 40 minutes.
Transparent Patch Antenna Using Silver Mesh Electrode
김동진(Dong Jin Kim),장효양(Hyoyang Jang),조문형(Munhyeong Jo),엄준성(Junseong Eom),이승섭(Seung S. Lee),이재흥(Jaeheung Lee) Korean Society for Precision Engineering 2018 한국정밀공학회지 Vol.35 No.9
This study presents a transparent-patch antenna using a silver-mesh transparent electrode film with a high optical transmittance (87.7%), low haze (1.1%), and low sheet resistance (8.9 Ω/sq). The silver-mesh transparent electrode film is fabricated by using UV embossing and doctor blading without any high-temperature or vacuum processes. The UV resin pattern is transferred from a nickel mold to a plastic film, and then a silver paste is filled into the UV resin pattern. The transparent antenna patch and ground plane are obtained by repeating these processes on both sides of a single plastic film. The antenna patch is designed with a width of 44.8 mm and a height of 36.0 mm in order to obtain a resonant frequency at 2.45 GHz, which is a frequency of wireless LAN. As a result, the transparent-patch antenna has a reflection coefficient (S11 parameter) of -35.6 dB, a peak gain of -3.99 dBi, and a radiation efficiency of 6.2% at 2.45 GHz. Finally, a Wi-Fi router using the transparent-patch antenna is demonstrated.
배기계 Hanger 위치 결정 및 Bellows효과에 관한 연구
이승섭(S.S.Lee),이장명(C.M.Lee) 한국자동차공학회 1993 한국자동차공학회 춘 추계 학술대회 논문집 Vol.- No.-
The hanger posi tions of the exhaust system can be determined to minimize the energy transferred into a body by the normal mode analysis of the total exhaust system using the Finite Element Method.<br/> During this procedure, the bellows effect is also studied using the forced vibration analysis. In this article, these analyses are performed below 200 Hz, equivalent 6000 rpD based on the 2nd order component of a four cylinder engine.<br/>
브리지 및 원형 금 박막의 기계적 물성 및 계면파괴인성치 측정
최우성(W.S. Choi),최승태(S.T. Choi),손상욱(S.U. Son),이승섭(S.S. Lee),양세영(S.Y. Yang),엄윤용(Y.Y. Earmme) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5
In order to measure the mechanical properties of gold films on Si substrate, two types of specimens, i.e., bridged films and circular membranes, are manufactured. Using the wedge tip, the bridged films are indented so that the bridged gold films are pushed off, which is called as V-peel test. The load-deflection curves obtained by the V-peel tests are analyzed with the concept of geometrically nonlinear beam by using the minimum potential energy theory together with Ritz method. Young’s modulus and residual stress of the bridged gold films are obtained. Blister test is also conducted to measure the Young’s modulus and residual stress of the circular membrane specimens, of which deformation is measured by Twyman-green interferometer. By gradually increasing the applied pressure in the blister test, the interfacial fracture toughness between the gold film and Si substrate is measured.