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Pulsed Electrochemical Deposition for 3D Micro Structuring
Park, Jung-Woo,Ryu, Shi-Hyoung,Chu, Chong-Nam Korean Society for Precision Engineering 2005 International Journal of Precision Engineering and Vol.6 No.4
In this paper, micro structuring technique using localized electrochemical deposition (LECD) with ultra short pulses was investigated. Electric field in electrochemical cell was localized near the tool tip end region by applying pulses of a few hundreds of nano second duration, Pt-Ir tip was used as a counter electrode and copper was deposited on the copper substrate in mixed electrolyte of 0.5 M $CuSO_4$ and 0.5 M $H_2SO_4$, The effectiveness of this technique was verified by comparison with ECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration were investigated. The proper condition was selected based on the results of the various experiments. Micro columns less than $10{\mu}m$ in diameter were fabricated using this technique. The real 3D micro structures such as micro spring and micro pattern were made by the presented method.
Kim, Bo Hyun,Ryu, Shi Hyoung,Choi, Deok Ki,Chu, Chong Nam IOP 2005 JOURNAL OF MICROMECHANICS AND MICROENGINEERING - Vol.15 No.1
<P>In this paper, electrochemical machining (ECM) for fabricating micro structures is presented. By applying ultra short pulses, dissolution of a workpiece can be restricted to the region very close to an electrode. Using this method, 3D micro structures were machined on stainless steel. Good surface quality of the structures was obtained in the low concentration electrolyte, 0.1 M H<SUB>2</SUB>SO<SUB>4</SUB>. In ECM, when the machining depth increases, structures taper. To reduce the taper, a disc-type electrode is introduced. By electrochemical milling, various 3D micro structures including a hemisphere with 60 µm diameter were fabricated.</P>
Pulsed Electrochemical Deposition for 3D Micro Structuring
Jung Woo Park,Shi Hyoung Ryu,Chong Nam Chu 한국정밀공학회 2005 International Journal of Precision Engineering and Vol.6 No.4
In this paper, micro structuring technique using localized electrochemical deposition (LECD) with ultra short pulses was investigated. Electric field in electrochemical cell was localized near the tool tip end region by applying pulses of a few hundreds of nano second duration. Pt-Ir tip was used as a counter electrode and copper was deposited on the copper substrate in mixed electrolyte of 0.5 M CUSO₄ and 0.5 M H₂SO₄. The effectiveness of this technique was verified by comparison with ECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration were investigated. The proper condition was selected based on the results of the various experiments. Micro columns less than 10 ㎛ in diameter were fabricated using this technique. The real 3D micro structures such as micro spring and micro pattern were made by the presented method.